LPC1112FHN33/102551
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NXP USA Inc. LPC1112FHN33/102551

Manufacturer No:
LPC1112FHN33/102551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Delivery:
Payment:
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Product Introduction

Overview

The LPC1112FHN33/102K is a 32-bit microcontroller from NXP USA Inc., part of the LPC11xx family. This microcontroller is based on the ARM Cortex-M0 processor, which operates at frequencies up to 50 MHz. It is designed for low-cost, low-power applications and is widely used in various embedded systems due to its robust feature set and efficient power management capabilities.

Key Specifications

AttributeValue
Family NameLPC11xx
Core ProcessorARM Cortex M0
Program Memory TypeFlash
Flash Size (Bytes)16 kB
RAM Size2 kB
Speed50 MHz
No of I/O Lines28
Interface Type / ConnectivityI2C/SPI/UART
PeripheralsBrownout Reset/Brown-out Detect/POR
Supply Voltage1.8 V to 3.6 V
Operating Temperature-40°C to +85°C
On-Chip ADC8-ch x 10-bit
Package StyleHVQFN-32
Mounting MethodSurface Mount

Key Features

  • ARM Cortex-M0 Processor: Operates at frequencies up to 50 MHz.
  • Memory and Storage: 16 kB of on-chip flash memory and 2 kB of SRAM.
  • Peripherals: Includes Brownout Reset, Brown-out Detect, Power-On Reset (POR), and a Programmable WatchDog Timer (WDT).
  • Analog Peripherals: Features a 10-bit ADC with input multiplexing among 5, 6, or 8 pins depending on the package size.
  • Serial Interfaces: Supports UART, SPI, and I2C-bus interfaces with various capabilities such as fractional baud rate generation and Fast-mode Plus.
  • Power Management: Integrated Power Management Unit (PMU) with Sleep, Deep-sleep, and Deep power-down modes to minimize power consumption.
  • GPIO and Interrupts: Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors and edge/level sensitive interrupt sources.

Applications

The LPC1112FHN33/102K is suitable for a variety of applications, including:

  • Industrial Automation: For control and monitoring in industrial environments.
  • Consumer Electronics: Used in devices such as smart home appliances and wearables.
  • Medical Devices: For low-power, high-reliability applications in medical equipment.
  • Automotive Systems: In vehicle control systems and sensors.
  • IoT Devices: For Internet of Things applications requiring low power and high efficiency.

Q & A

  1. What is the core processor of the LPC1112FHN33/102K?
    The core processor is the ARM Cortex-M0.
  2. What is the maximum operating frequency of the LPC1112FHN33/102K?
    The maximum operating frequency is 50 MHz.
  3. How much flash memory does the LPC1112FHN33/102K have?
    The LPC1112FHN33/102K has 16 kB of on-chip flash memory.
  4. What are the supply voltage and operating temperature ranges of the LPC1112FHN33/102K?
    The supply voltage range is 1.8 V to 3.6 V, and the operating temperature range is -40°C to +85°C.
  5. Does the LPC1112FHN33/102K support in-system programming?
    Yes, it supports In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.
  6. What types of serial interfaces does the LPC1112FHN33/102K support?
    The LPC1112FHN33/102K supports UART, SPI, and I2C-bus interfaces.
  7. What is the package style and mounting method of the LPC1112FHN33/102K?
    The package style is HVQFN-32, and the mounting method is Surface Mount.
  8. Does the LPC1112FHN33/102K have any power-saving modes?
    Yes, it has Sleep, Deep-sleep, and Deep power-down modes to minimize power consumption.
  9. How many GPIO pins does the LPC1112FHN33/102K have?
    The LPC1112FHN33/102K has up to 28 GPIO pins.
  10. What is the resolution of the on-chip ADC in the LPC1112FHN33/102K?
    The on-chip ADC has a resolution of 10 bits.

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1112FHN33/102551 LPC1112FHN33/202551 LPC1112FHN33/101551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28
Program Memory Size 16KB (16K x 8) 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size - - -
RAM Size 2K x 8 4K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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