LPC1112FHN33/202551
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NXP USA Inc. LPC1112FHN33/202551

Manufacturer No:
LPC1112FHN33/202551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Delivery:
Payment:
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Product Introduction

Overview

The LPC1112FHN33 is a 32-bit microcontroller from NXP USA Inc., part of the LPC1100 series. This microcontroller is based on the Arm Cortex-M0 core and is designed to offer high performance and low power consumption. It operates at CPU frequencies of up to 50 MHz, making it suitable for a variety of embedded applications. The LPC1112FHN33 is known for its compact package and extensive set of peripherals, which enhance its versatility and efficiency in different use cases.

Key Specifications

ParameterValue
Part NumberLPC1112FHN33/202551
CategoryEmbedded - Microcontrollers
ManufacturerNXP USA Inc.
DescriptionIC MCU 32BIT 16KB FLASH 32HVQFN
Package / Case32-HVQFN
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Speed50MHz
Number of I/O16
Core ProcessorARM® Cortex®-M0
RAM Size4K x 8
Core Size32-Bit
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT
Program Memory Size16KB (16K x 8)
Program Memory TypeFLASH
Data ConvertersA/D 5x10b
Oscillator TypeInternal

Key Features

  • High Performance: Operates at CPU frequencies of up to 50 MHz.
  • Low Power Consumption: Designed for low power applications.
  • Compact Package: Available in a 32-HVQFN package.
  • Extensive Peripherals: Includes I²C, SPI, UART/USART, Brown-out Detect/Reset, POR, and WDT.
  • Memory and Storage: 16KB of FLASH program memory and 4K x 8 bytes of RAM.
  • Analog to Digital Conversion: Features a 5x10-bit A/D converter.

Applications

The LPC1112FHN33 microcontroller is suitable for a wide range of embedded applications, including but not limited to:

  • Industrial Automation: Control systems, sensors, and actuators.
  • Consumer Electronics: Home appliances, personal care devices, and gaming consoles.
  • Medical Devices: Portable medical devices, diagnostic equipment, and patient monitoring systems.
  • Automotive Systems: In-vehicle infotainment, safety systems, and automotive control units.
  • IoT Devices: Smart home devices, wearables, and other Internet of Things applications.

Q & A

  1. What is the core processor of the LPC1112FHN33 microcontroller?
    The core processor is the ARM® Cortex®-M0.
  2. What is the maximum operating frequency of the LPC1112FHN33?
    The maximum operating frequency is 50 MHz.
  3. What is the package type of the LPC1112FHN33?
    The package type is 32-HVQFN.
  4. What is the operating temperature range of the LPC1112FHN33?
    The operating temperature range is -40°C to 85°C (TA).
  5. What are the primary peripherals included in the LPC1112FHN33?
    The primary peripherals include I²C, SPI, UART/USART, Brown-out Detect/Reset, POR, and WDT.
  6. How much program memory does the LPC1112FHN33 have?
    The LPC1112FHN33 has 16KB of FLASH program memory.
  7. What is the RAM size of the LPC1112FHN33?
    The RAM size is 4K x 8 bytes.
  8. Does the LPC1112FHN33 have an internal oscillator?
    Yes, it has an internal oscillator.
  9. What type of data converters are included in the LPC1112FHN33?
    The LPC1112FHN33 includes a 5x10-bit A/D converter.
  10. Is the LPC1112FHN33 RoHS compliant?
    Yes, the LPC1112FHN33 is RoHS compliant.

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:4K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1112FHN33/202551 LPC1113FHN33/202551 LPC1114FHN33/202551 LPC1111FHN33/202551 LPC1112FHN33/102551 LPC1112FHN33/201551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28 28 28 28
Program Memory Size 16KB (16K x 8) 24KB (24K x 8) 32KB (32K x 8) 8KB (8K x 8) 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - -
RAM Size 4K x 8 4K x 8 4K x 8 4K x 8 2K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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