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FS32R274KCK2MMM
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NXP USA Inc. FS32R274KCK2MMM

Manufacturer No:
FS32R274KCK2MMM
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT 2MB FLASH 257MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FS32R274KCK2MMM is a 32-bit microcontroller from NXP USA Inc., designed for high-performance applications in the automotive and industrial sectors. This microcontroller is based on the Power Architecture e200z4/e200z7 RISC core and is AEC-Q100 Grade 1 qualified, ensuring robust reliability and performance in demanding environments.

Key Specifications

SpecificationValue
Microcontroller Type32-bit e200z4/e200z7 RISC
Flash Memory2MB
Operating Voltage3.3V
Package Type257-Pin LFBGA
QualificationAEC-Q100 Grade 1
Mounting TypeSurface Mount
Country of OriginMalaysia

Key Features

  • High-performance 32-bit e200z4/e200z7 RISC core
  • 2MB of Flash memory for extensive program storage
  • AEC-Q100 Grade 1 qualification for automotive reliability
  • 257-pin LFBGA package for high-density integration
  • Surface mount technology for easy board assembly

Applications

The FS32R274KCK2MMM microcontroller is primarily used in automotive and industrial applications where high performance and reliability are critical. This includes advanced driver-assistance systems (ADAS), engine control units, and other high-reliability industrial control systems.

Q & A

  1. What is the core architecture of the FS32R274KCK2MMM microcontroller?
    The FS32R274KCK2MMM is based on the 32-bit e200z4/e200z7 RISC core.
  2. How much Flash memory does the FS32R274KCK2MMM have?
    The FS32R274KCK2MMM has 2MB of Flash memory.
  3. What is the operating voltage of the FS32R274KCK2MMM?
    The operating voltage is 3.3V.
  4. What package type does the FS32R274KCK2MMM use?
    The FS32R274KCK2MMM uses a 257-Pin LFBGA package.
  5. Is the FS32R274KCK2MMM qualified for automotive use?
    Yes, it is AEC-Q100 Grade 1 qualified.
  6. What is the mounting type of the FS32R274KCK2MMM?
    The mounting type is surface mount.
  7. Where is the FS32R274KCK2MMM manufactured?
    The FS32R274KCK2MMM is manufactured in Malaysia.
  8. What are the primary applications of the FS32R274KCK2MMM?
    The primary applications include automotive and industrial high-performance systems.
  9. Does the FS32R274KCK2MMM support advanced driver-assistance systems (ADAS)?
    Yes, it supports ADAS and other automotive applications.
  10. Is the FS32R274KCK2MMM suitable for engine control units?
    Yes, it is suitable for engine control units and other high-reliability industrial control systems.

Product Attributes

Core Processor:e200z4, e200z7 (2)
Core Size:32-Bit Tri-Core
Speed:180MHz, 240MHz
Connectivity:CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals:POR, PWM, WDT
Number of I/O:- 
Program Memory Size:2MB (2M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:1.5M x 8
Voltage - Supply (Vcc/Vdd):1.19V ~ 5.5V
Data Converters:A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:257-LFBGA
Supplier Device Package:257-LFBGA (14x14)
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Similar Products

Part Number FS32R274KCK2MMM FS32R274KSK2MMM FS32R274VCK2MMM FS32R274KCK2VMM FS32R274KBK2MMM
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Obsolete
Core Processor e200z4, e200z7 (2) e200z4, e200z7 (2) e200z4, e200z7 (2) e200z4, e200z7 (2) e200z4, e200z7 (2)
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 180MHz, 240MHz 180MHz, 240MHz 180MHz, 240MHz 180MHz, 240MHz 180MHz, 240MHz
Connectivity CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT
Number of I/O - - - - -
Program Memory Size 2MB (2M x 8) 2MB (2M x 8) 2MB (2M x 8) 2MB (2M x 8) 2MB (2M x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 1.5M x 8 1.5M x 8 1.5M x 8 1.5M x 8 1.5M x 8
Voltage - Supply (Vcc/Vdd) 1.19V ~ 5.5V 1.19V ~ 5.5V 1.19V ~ 5.5V 1.19V ~ 5.5V 1.19V ~ 5.5V
Data Converters A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 257-LFBGA 257-LFBGA 257-LFBGA 257-LFBGA 257-LFBGA
Supplier Device Package 257-LFBGA (14x14) 257-LFBGA (14x14) 257-LFBGA (14x14) 257-LFBGA (14x14) 257-LFBGA (14x14)

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