FS32R274VCK2MMM
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NXP USA Inc. FS32R274VCK2MMM

Manufacturer No:
FS32R274VCK2MMM
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 2MB FLASH 257MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FS32R274VCK2MMM is a 32-bit Power Architecture-based microcontroller developed by NXP USA Inc. It is part of the S32R264 and S32R274 series, which are AEC-Q100 Grade 1 qualified. These microcontrollers are designed for automotive and industrial high-performance radar applications, offering advanced radar signal processing capabilities combined with generic software task handling and car bus interfacing. The S32R274 provides a significant performance boost, with a >4x leap in performance per power compared to previous MPC577X products, making it ideal for next-generation automotive radar modules.

Key Specifications

ParameterValue
Core Processore200z4, e200z7 (Tri-Core)
Core Size32-Bit
Speed180MHz, 240MHz
ConnectivityCANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Operating Temperature-40°C ~ 105°C (TA)
QualificationAEC-Q100 Grade 1

Key Features

  • Advanced Radar Signal Processing: The S32R274 integrates advanced signal processing acceleration, making it suitable for modern beam-forming fast chirp modulation radar systems.
  • Multi-Core Architecture: The tri-core architecture enhances performance and efficiency.
  • Functional Safety: Compliant with ISO 26262 through NXP's SafeAssure program, ensuring system-level safety requirements are met.
  • High Integration: Offers increased integration compared to previous models, supporting next-generation automotive radar modules.

Applications

  • Automotive Radar Systems: Designed for high-performance radar applications in the automotive sector.
  • Industrial Radar Systems: Suitable for industrial radar applications requiring advanced signal processing and high performance.

Q & A

  1. What is the core processor of the FS32R274VCK2MMM?
    The core processor is e200z4 and e200z7 (Tri-Core).
  2. What is the operating temperature range of the FS32R274VCK2MMM?
    The operating temperature range is -40°C ~ 105°C (TA).
  3. Is the FS32R274VCK2MMM AEC-Q100 qualified?
    Yes, it is AEC-Q100 Grade 1 qualified.
  4. What are the key connectivity options of the FS32R274VCK2MMM?
    The key connectivity options include CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, and UART/USART.
  5. What is the significance of NXP's SafeAssure program for the FS32R274VCK2MMM?
    NXP's SafeAssure program ensures compliance with ISO 26262, simplifying system-level safety requirements.
  6. How does the S32R274 compare to previous MPC577X products in terms of performance?
    The S32R274 offers a >4x leap in performance per power compared to previous MPC577X products.
  7. What are the primary applications of the FS32R274VCK2MMM?
    The primary applications are in automotive and industrial high-performance radar systems.
  8. What is the clock speed of the FS32R274VCK2MMM?
    The clock speed is 180MHz and 240MHz.
  9. Does the FS32R274VCK2MMM support advanced signal processing for radar systems?
    Yes, it integrates advanced signal processing acceleration for modern beam-forming fast chirp modulation radar systems.
  10. What is the architecture of the FS32R274VCK2MMM?
    The architecture is a 32-bit tri-core based on Power Architecture.

Product Attributes

Core Processor:e200z4, e200z7 (2)
Core Size:32-Bit Tri-Core
Speed:180MHz, 240MHz
Connectivity:CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals:POR, PWM, WDT
Number of I/O:- 
Program Memory Size:2MB (2M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:1.5M x 8
Voltage - Supply (Vcc/Vdd):1.19V ~ 5.5V
Data Converters:A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:257-LFBGA
Supplier Device Package:257-LFBGA (14x14)
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Similar Products

Part Number FS32R274VCK2MMM FS32R274VCK2VMM FS32R274KCK2MMM FS32R274VBK2MMM
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor e200z4, e200z7 (2) e200z4, e200z7 (2) e200z4, e200z7 (2) e200z4, e200z7 (2)
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 180MHz, 240MHz 180MHz, 240MHz 180MHz, 240MHz 180MHz, 240MHz
Connectivity CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT
Number of I/O - - - -
Program Memory Size 2MB (2M x 8) 2MB (2M x 8) 2MB (2M x 8) 2MB (2M x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 1.5M x 8 1.5M x 8 1.5M x 8 1.5M x 8
Voltage - Supply (Vcc/Vdd) 1.19V ~ 5.5V 1.19V ~ 5.5V 1.19V ~ 5.5V 1.19V ~ 5.5V
Data Converters A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 257-LFBGA 257-LFBGA 257-LFBGA 257-LFBGA
Supplier Device Package 257-LFBGA (14x14) 257-LFBGA (14x14) 257-LFBGA (14x14) 257-LFBGA (14x14)

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