Overview
The BGA2022,115 is a mixer IC designed by NXP Semiconductors, now part of NXP USA Inc. This component is no longer in production but was widely used in various RF and wireless applications. It is packaged in a 6-lead TSSOP (Thin Shrink Small Outline Package) with dimensions of 2 mm x 1.25 mm x 0.95 mm and a lead pitch of 0.65 mm.
Key Specifications
| Parameter | Value |
|---|---|
| Manufacturer | NXP USA Inc. |
| Package Type | TSSOP6 |
| Package Dimensions | 2 mm x 1.25 mm x 0.95 mm |
| Lead Pitch | 0.65 mm |
| Frequency Range | 900 MHz to 2.4 GHz |
| Current Supply | 10 mA |
| Gain | 8 dB |
Key Features
- Operates in the frequency range of 900 MHz to 2.4 GHz, making it suitable for various wireless applications.
- Compact TSSOP6 package, ideal for space-constrained designs.
- Low current supply of 10 mA, contributing to energy efficiency.
- A gain of 8 dB, providing adequate signal amplification.
Applications
- Wireless communication systems, including cellular networks and wireless local area networks (WLANs).
- RF front-end modules in mobile devices and base stations.
- Other RF and microwave applications requiring a mixer IC with a broad frequency range.
Q & A
- What is the BGA2022,115? The BGA2022,115 is a mixer IC designed by NXP Semiconductors, used in RF and wireless applications.
- What is the package type of the BGA2022,115? It is packaged in a TSSOP6 (Thin Shrink Small Outline Package) with 6 leads.
- What are the dimensions of the BGA2022,115 package? The package dimensions are 2 mm x 1.25 mm x 0.95 mm.
- What is the frequency range of the BGA2022,115? It operates in the frequency range of 900 MHz to 2.4 GHz.
- What is the current supply of the BGA2022,115? The current supply is 10 mA.
- What is the gain of the BGA2022,115? The gain is 8 dB.
- Is the BGA2022,115 still in production? No, the BGA2022,115 is no longer manufactured.
- What are some common applications of the BGA2022,115? It is used in wireless communication systems, RF front-end modules, and other RF and microwave applications.
- Where can I find more detailed specifications for the BGA2022,115? Detailed specifications can be found on the official NXP Semiconductors website or through authorized distributors like Digi-Key.
- What is the lead pitch of the TSSOP6 package? The lead pitch is 0.65 mm.
