NAND256W3A2BZA6F TR
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Micron Technology Inc. NAND256W3A2BZA6F TR

Manufacturer No:
NAND256W3A2BZA6F TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC FLSH 256MBIT PARALLEL 55VFBGA
Delivery:
Payment:
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iso9001
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Product Introduction

Overview

The NAND256W3A2BZA6F TR is a high-capacity NAND flash memory device produced by Micron Technology Inc. This component is designed to meet the demanding storage needs of modern electronic devices, offering high storage density and reliable performance.

Micron's NAND flash technology is renowned for its efficiency, durability, and speed, making it an ideal choice for a wide range of applications, from consumer electronics to industrial and automotive systems.

Key Specifications

Parameter Value
Capacity 256 Gb (Gigabits)
Interface ONFI 4.0, Toggle 2.0
Package Type TSOP (Thin Small Outline Package)
Operating Voltage 2.7V to 3.6V
Read Speed Up to 200 MB/s
Write Speed Up to 100 MB/s
Endurance Typically 3,000 to 5,000 program/erase cycles
Temperature Range -40°C to 85°C (Industrial Grade)

Key Features

  • High Storage Capacity: Offers 256 Gb of storage, making it suitable for applications requiring large data storage.
  • Fast Read and Write Speeds: Supports high-speed data transfer rates, enhancing system performance.
  • Low Power Consumption: Designed to operate within a low voltage range, reducing power consumption and heat generation.
  • Reliability and Durability: Built with Micron's robust NAND flash technology, ensuring high reliability and endurance.
  • Wide Temperature Range: Operates effectively across a broad temperature range, making it suitable for various environmental conditions.

Applications

  • Consumer Electronics: Smartphones, tablets, and other portable devices.
  • Industrial Systems: Automation, IoT devices, and industrial control systems.
  • Automotive Systems: Infotainment systems, navigation, and other automotive applications.
  • Embedded Systems: Set-top boxes, gaming consoles, and other embedded devices.

Q & A

  1. What is the storage capacity of the NAND256W3A2BZA6F TR?

    The NAND256W3A2BZA6F TR has a storage capacity of 256 Gb.

  2. What interface does the NAND256W3A2BZA6F TR support?

    The device supports ONFI 4.0 and Toggle 2.0 interfaces.

  3. What is the package type of the NAND256W3A2BZA6F TR?

    The package type is TSOP (Thin Small Outline Package).

  4. What is the operating voltage range of the NAND256W3A2BZA6F TR?

    The operating voltage range is 2.7V to 3.6V.

  5. What are the typical read and write speeds of the NAND256W3A2BZA6F TR?

    The typical read speed is up to 200 MB/s, and the typical write speed is up to 100 MB/s.

  6. How many program/erase cycles can the NAND256W3A2BZA6F TR endure?

    The device typically endures 3,000 to 5,000 program/erase cycles.

  7. What is the temperature range for the NAND256W3A2BZA6F TR?

    The device operates within a temperature range of -40°C to 85°C (Industrial Grade).

  8. What are some common applications for the NAND256W3A2BZA6F TR?

    Common applications include consumer electronics, industrial systems, automotive systems, and embedded systems.

  9. Why is the NAND256W3A2BZA6F TR suitable for industrial and automotive applications?

    It is suitable due to its high reliability, durability, and ability to operate across a wide temperature range.

  10. How does the NAND256W3A2BZA6F TR contribute to power efficiency in devices?

    The device contributes to power efficiency by operating within a low voltage range, reducing power consumption and heat generation.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NAND
Memory Size:256Mb (32M x 8)
Memory Interface:Parallel
Clock Frequency:- 
Write Cycle Time - Word, Page:50ns
Access Time:50 ns
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:55-TFBGA
Supplier Device Package:55-VFBGA (8x10)
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