MT53D1024M32D4DT-046 WT:D TR
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Micron Technology Inc. MT53D1024M32D4DT-046 WT:D TR

Manufacturer No:
MT53D1024M32D4DT-046 WT:D TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 32GBIT 2.133GHZ 200VFBGA
Delivery:
Payment:
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Product Introduction

Overview

The MT53D1024M32D4DT-046 WT:D TR is a high-performance, low-power DDR4 SDRAM module manufactured by Micron Technology Inc. This component is designed for mobile applications, offering a robust and reliable memory solution with a wide temperature range. It is internally configured with a 1024 Meg x 32 bit organization, making it suitable for demanding mobile and embedded systems.

Key Specifications

SpecificationValue
ManufacturerMicron Technology Inc.
Part NumberMT53D1024M32D4DT-046 WT:D TR
Memory TypeMobile LPDDR4 SDRAM
Memory Density32 Gbit
Data Bus Width32 bit
Maximum Clock Frequency2.133 GHz
Memory Organization1024 Meg x 32
Maximum Supply Voltage1.1 V
Minimum Operating Temperature-25°C
Maximum Operating Temperature+85°C
Package/Case200-VFBGA
No. of Pins200 Pins
RoHS ComplianceYes

Key Features

  • Wide Temperature Range (D): Operates from -25°C to +85°C, making it suitable for applications in varying temperature conditions.
  • High Reliability (TR): Designed for high reliability and robustness.
  • Low Power Consumption: Features low VDDQ (LPDDR4X) for reduced power consumption.
  • High-Speed Operation: Supports a maximum clock frequency of 2.133 GHz.
  • Internal Configuration: Internally configured with x16 I/O, 8-banks, and 16n prefetch DDR architecture.
  • Programmable Latencies and Burst Lengths: Supports programmable READ and WRITE latencies and burst lengths.
  • On-Chip Temperature Sensor: Includes an on-chip temperature sensor for controlling self-refresh rate and partial-array self-refresh (PASR).

Applications

The MT53D1024M32D4DT-046 WT:D TR is ideal for various mobile and embedded systems that require high-performance, low-power memory solutions. These include:

  • Smartphones and tablets
  • Automotive systems
  • Industrial control systems
  • IoT devices
  • Other embedded systems requiring robust and reliable memory.

Q & A

  1. What is the maximum clock frequency of the MT53D1024M32D4DT-046 WT:D TR?
    The maximum clock frequency is 2.133 GHz.
  2. What is the memory density of this component?
    The memory density is 32 Gbit.
  3. What is the operating temperature range of this component?
    The operating temperature range is from -25°C to +85°C.
  4. Is the MT53D1024M32D4DT-046 WT:D TR RoHS compliant?
    Yes, it is RoHS compliant.
  5. What is the package type of this component?
    The package type is 200-VFBGA.
  6. What are the key features of the MT53D1024M32D4DT-046 WT:D TR?
    Key features include wide temperature range, high reliability, low power consumption, high-speed operation, and programmable latencies and burst lengths.
  7. What types of applications is this component suitable for?
    This component is suitable for mobile and embedded systems, including smartphones, tablets, automotive systems, industrial control systems, and IoT devices.
  8. Does the MT53D1024M32D4DT-046 WT:D TR have an on-chip temperature sensor?
    Yes, it includes an on-chip temperature sensor for controlling self-refresh rate and partial-array self-refresh (PASR).
  9. What is the supply voltage of this component?
    The nominal supply voltage is 1.1 V.
  10. How many pins does the MT53D1024M32D4DT-046 WT:D TR have?
    The component has 200 pins.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - Mobile LPDDR4
Memory Size:32Gb (1G x 32)
Memory Interface:- 
Clock Frequency:2.133 GHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:1.1V
Operating Temperature:-30°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:200-VFBGA
Supplier Device Package:200-VFBGA (10x14.5)
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