MT47H64M16NF-25E:M TR
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Micron Technology Inc. MT47H64M16NF-25E:M TR

Manufacturer No:
MT47H64M16NF-25E:M TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 1GBIT PARALLEL 84FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MT47H64M16NF-25E IT:M TR is a 1 Gb (64M x 16) DDR2 SDRAM module manufactured by Micron Technology Inc. This component is designed to provide high-speed memory solutions for a variety of applications. It features an 84-ball Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for surface mount technology. The module is RoHS-compliant and lead-free, ensuring environmental sustainability and compliance with regulatory standards.

Key Specifications

Category Description
Manufacturer Micron Technology Inc.
Description IC DRAM 1GBIT PARALLEL 84FBGA
Package Tape & Reel (TR), 84-TFBGA
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Memory Size 1Gb (64M x 16)
Technology SDRAM - DDR2
Memory Type Volatile
Clock Frequency 400 MHz
Access Time 400 ps
Write Cycle Time - Word, Page 15ns
Memory Interface Parallel

Key Features

  • Programmable CAS latency (CL) with options for CL = 3, 4, 5, 6, and 7
  • Selectable burst lengths (BL): 4 or 8
  • Adjustable data-output drive strength
  • On-die termination (ODT)
  • Differential data strobe (DQS, DQS) option
  • Duplicate output strobe (RDQS) option for x8 configurations
  • Industrial temperature (IT) option with operating range of -40°C to 85°C
  • RoHS-compliant and lead-free
  • Supports JEDEC clock jitter specification

Applications

The MT47H64M16NF-25E IT:M TR is suitable for a wide range of applications requiring high-speed and reliable memory solutions. These include:

  • Embedded systems and industrial control systems
  • Networking and telecommunications equipment
  • Consumer electronics such as set-top boxes and gaming consoles
  • Automotive systems requiring robust and temperature-stable memory
  • Server and storage systems where high-capacity and low-latency memory are critical

Q & A

  1. What is the memory size of the MT47H64M16NF-25E IT:M TR?

    The memory size is 1 Gb, configured as 64M x 16.

  2. What is the package type of this component?

    The component is packaged in an 84-ball Fine-Pitch Ball Grid Array (FBGA) and is supplied in Tape & Reel (TR).

  3. What are the operating temperature ranges for this component?

    The operating temperature range is -40°C to 85°C (TA).

  4. Is the MT47H64M16NF-25E IT:M TR RoHS-compliant?

    Yes, it is RoHS-compliant and lead-free.

  5. What are the available CAS latency options for this component?

    The CAS latency (CL) options include CL = 3, 4, 5, 6, and 7.

  6. Does the component support differential data strobe?

    Yes, it supports differential data strobe (DQS, DQS) options.

  7. What is the clock frequency of the MT47H64M16NF-25E IT:M TR?

    The clock frequency is 400 MHz.

  8. Can the data-output drive strength be adjusted?

    Yes, the data-output drive strength is adjustable.

  9. Does the component support on-die termination (ODT)?

    Yes, it supports on-die termination (ODT).

  10. What are the typical applications for this component?

    Typical applications include embedded systems, networking equipment, consumer electronics, automotive systems, and server/storage systems.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR2
Memory Size:1Gb (64M x 16)
Memory Interface:Parallel
Clock Frequency:400 MHz
Write Cycle Time - Word, Page:15ns
Access Time:400 ps
Voltage - Supply:1.7V ~ 1.9V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:84-TFBGA
Supplier Device Package:84-FBGA (8x12.5)
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