CYUSB3014-BZXIT
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Infineon Technologies CYUSB3014-BZXIT

Manufacturer No:
CYUSB3014-BZXIT
Manufacturer:
Infineon Technologies
Package:
Tape & Reel (TR)
Description:
IC ARM9 USB CONTROLLER 121FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The CYUSB3014-BZXIT is a part of Infineon Technologies' EZ-USB™ FX3 family, which represents the industry’s most versatile USB peripheral controller. This device is designed to add USB 5 Gbps connectivity to virtually any system, making it highly adaptable for various applications. The EZ-USB™ FX3 integrates a 200 MHz ARM926EJ-S core and a 5-Gbps SuperSpeed PHY, ensuring high-speed data transfer and robust processing capabilities.

Key Specifications

Specification Details
USB Standard USB 3.2 Gen 1, USB 2.0 compliant
USB Speed 5 Gbps
CPU ARM926EJ-S core, 200 MHz operation
Memory 512 KB or 256 KB embedded SRAM
General Programmable Interface (GPIF II) Programmable 100 MHz GPIF II, supports 8-, 16-, 24-, and 32-bit data bus
Endpoints 32 USB endpoints (16 IN and 16 OUT)
Additional Interfaces SPI master up to 33 MHz, UART up to 4 Mbps, I2C master up to 1 MHz, I2S master
Power Modes Ultra low-power in core power-down mode, less than 60 µA with VBATT on and 20 µA with VBATT off
Package 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)

Key Features

  • Integrated USB 5 Gbps PHY compliant with USB 3.2 Gen 1 and backward compatible with USB 2.0.
  • High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0.
  • General programmable interface (GPIF II) that can connect to a processor, image sensor, FPGA, or ASIC, and can be programmed to behave like a FIFO, an asynchronous SRAM, an address/data multiplexed interface, a CompactFlash, or a proprietary interface.
  • Supports Carkit Pass-Through UART functionality on USB D+/D– lines based on the CEA-936A specification.
  • Independent power domains for core and I/O, with core operation at 1.2 V and I/O operation at 1.8 to 3.3 V.
  • EZ-USB® software development kit (SDK) for code development of firmware and PC applications, including RTOS Framework (using ThreadX Version 5) and firmware examples covering all I/O modules.
  • SuperSpeed explorer board available for rapid prototyping along with several accessory boards.

Applications

  • Digital input/output (I/O) modules
  • Industrial robots system solutions for Industry 4.0
  • Information & communication technologies
  • Factory automation: machine vision, production monitoring, quality inspection, vision-guided robotics, text/barcode recognition, and sorting and logistics.
  • Medical and life sciences: lab equipment and automation, microscopy, ophthalmology, dermatology, dentistry, 3D scanners for prosthetics creation, imaging procedures in surgery, and motion analysis and therapy.
  • Retail: ATMs, vending machines, kiosks, shelf inspection, and point-of-sale systems.
  • Security and surveillance: biometrics and recognition, people counting and tracking, asset management, and law enforcement.

Q & A

  1. What is the USB speed supported by the CYUSB3014-BZXIT?

    The CYUSB3014-BZXIT supports USB speeds up to 5 Gbps, compliant with USB 3.2 Gen 1 and backward compatible with USB 2.0.

  2. What type of CPU does the CYUSB3014-BZXIT use?

    The CYUSB3014-BZXIT uses an ARM926EJ-S core operating at 200 MHz.

  3. What is the GPIF II and its capabilities?

    The GPIF II is a general programmable interface that can connect to a processor, image sensor, FPGA, or ASIC. It can be programmed to behave like a FIFO, an asynchronous SRAM, an address/data multiplexed interface, a CompactFlash, or a proprietary interface.

  4. What additional interfaces does the CYUSB3014-BZXIT support?

    The device supports SPI master up to 33 MHz, UART up to 4 Mbps, I2C master up to 1 MHz, and I2S master.

  5. What are the power consumption characteristics of the CYUSB3014-BZXIT?

    The device has ultra low-power consumption in core power-down mode, with less than 60 µA with VBATT on and 20 µA with VBATT off.

  6. What package options are available for the CYUSB3014-BZXIT?

    The device is available in a 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA) package.

  7. What software development tools are provided for the CYUSB3014-BZXIT?

    The EZ-USB® software development kit (SDK) is provided, which includes RTOS Framework (using ThreadX Version 5) and firmware examples covering all I/O modules.

  8. What are some of the key applications of the CYUSB3014-BZXIT?

    The device is used in factory automation, medical and life sciences, retail, and security and surveillance applications.

  9. Does the CYUSB3014-BZXIT support OTG functionality?

    Yes, the device supports high-speed On-The-Go (HS-OTG) host and peripheral functionality compliant with OTG Supplement Version 2.0.

  10. What is the significance of the SuperSpeed explorer board for the CYUSB3014-BZXIT?

    The SuperSpeed explorer board is available for rapid prototyping and development, along with several accessory boards for various development needs.

Product Attributes

Applications:SuperSpeed USB Peripheral Controller
Core Processor:ARM9®
Program Memory Type:External Program Memory
Controller Series:CYUSB
RAM Size:512K x 8
Interface:GPIF, I²C, I²S, SPI, UART, USB
Number of I/O:60
Voltage - Supply:1.15V ~ 1.25V
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:121-TFBGA
Supplier Device Package:121-FBGA (10x10)
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Similar Products

Part Number CYUSB3014-BZXIT CYUSB2014-BZXIT CYUSB3014-BZXCT CYUSB3014-BZXI
Manufacturer Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Product Status Active Active Active Active
Applications SuperSpeed USB Peripheral Controller SuperSpeed USB Peripheral Controller SuperSpeed USB Peripheral Controller SuperSpeed USB Peripheral Controller
Core Processor ARM9® ARM9® ARM9® ARM9®
Program Memory Type External Program Memory External Program Memory External Program Memory External Program Memory
Controller Series CYUSB CYUSB CYUSB CYUSB
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8
Interface GPIF, I²C, I²S, SPI, UART, USB I²C, I²S, MMC/SD, SPI, UART, USB GPIF, I²C, I²S, SPI, UART, USB GPIF, I²C, I²S, SPI, UART, USB
Number of I/O 60 59 60 60
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 121-TFBGA 121-TFBGA 121-TFBGA 121-TFBGA
Supplier Device Package 121-FBGA (10x10) 121-FBGA (10x10) 121-FBGA (10x10) 121-FBGA (10x10)

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