WeEn Top Side Cooling SiC product introduction
WeEn Semiconductor introduces a range of top-side-cooling (TSC), surface-mount (SMD) SiC devices in packages including TSPAK and TOLT, both SiC Schottky diodes and SiC MOSFETs have been launched to the market.
Compared with traditional bottom-side-cooling SMD devices, the top-side-cooling package provides customers with a more flexible thermal dissipating solution, which can explore the performance potential of SiC devices to a greater extent. Based on the TSC package design, heat can be directly conducted to the heat sink without going through the thermal vias of the PCB, significantly reducing the thermal resistance from the junction to the heat sink by about 17% to 19%, which helps to improve circuit performance or reduce power device specifications to save costs.
By eliminating thermal vias or PCB heat dissipation copper area, return current can flow directly under the device, helping to achieve minimal current loop area and very low trace parasitic inductance, thereby significantly reducing switching losses and EMI radiation. Help shorten product EMC debugging time and save EMC improvement costs.
The TSC package not only offers thermal performance comparable with traditional through-hole-mount packages such as TO-247, but also has the advantages of an SMD device PCB assembly, manufacturing speed, stability and automation level will be improved.
WeEn offers a rich portfolio of TSC parts, including industrial and automotive-grade products. TSC packaging can be applied to various power conversion equipment, such as EV OBC, EVC modules, server power supplies, photovoltaic inverters, etc., to help product designs improve power density and save costs. For applications that require high efficiency, high frequency, low Tj, high power density and long endurance, should consider trying the topside cooling devices. Here are some application suggestions:
TSPAK: EV on board charger, EV E-compressor, EV charging station, PV inverters
TOLT: Telecom/Server/PC power supply unit, PV inverters, ESS & UPS
Most popular application circuits use MOSFETs and diodes, such as Boost PFC, LLC primary and secondary, Vienna PFC, etc. The heat sink surface needs to be shared, and the MOSFET switch and freewheeling Diode need to be in the same package to obtain coplanarity. WeEn has acknowledged this fact and released SiC MOSFETs and diodes in both TSPAK and TOLT packages. This will help customers generate new solutions to adopt new packages as easily as possible.
The WeEn TOLT products offer 650V 20~70mΩ SiC MOSFETs and 10~20A SiC SBD.
The WeEn TSPAK products offer 650V~1200V, 12~150mΩ SiC MOSFETs, and 10~40A SiC SBD, both industrial and automotive grade devices are included.
Industrial products:
Automotive grade parts:
