Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
116-87-624-41-018101
116-87-624-41-018101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
327 $1.47
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
06-2513-10
06-2513-10
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
175 $1.42
Lo-PRO®file, 513 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
06-6513-10T
06-6513-10T
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
252 $1.39
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-0518-10T
10-0518-10T
CONN SOCKET SIP 10POS GOLD
Aries Electronics
394 $1.41
518 Bulk ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
10-1518-10T
10-1518-10T
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
277 $1.39
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
11-0518-10
11-0518-10
CONN SOCKET SIP 11POS GOLD
Aries Electronics
304 $1.40
518 Bulk ActiveSIP11 (1 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
03-0517-90C
03-0517-90C
CONN SOCKET SIP 3POS GOLD
Aries Electronics
459 $1.40
0517 Bulk ActiveSIP3 (1 x 3)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
146-87-318-41-035101
146-87-318-41-035101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
338 $1.41
146 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
146-87-318-41-036101
146-87-318-41-036101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
199 $1.39
146 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-420-41-012101
116-87-420-41-012101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
19 $1.46
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-320-41-105101
110-83-320-41-105101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
651 $1.47
110 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
614-87-324-31-012101
614-87-324-31-012101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
55 $1.46
614 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
614-87-424-31-012101
614-87-424-31-012101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
556 $1.46
614 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-032-09-041101
510-83-032-09-041101
CONN SOCKET PGA 32POS GOLD
Preci-Dip
625 $1.48
510 Bulk ActivePGA32 (9 x 9)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
299-83-308-11-001101
299-83-308-11-001101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
187 $1.46
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-428-41-001101
110-83-428-41-001101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
599 $1.46
110 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-628-41-001101
110-83-628-41-001101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
357 $1.47
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-628-41-001151
110-83-628-41-001151
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
51 $1.47
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen Frame, No Center BarSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
08-3513-10
08-3513-10
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
419 $1.44
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
612-83-320-41-001101
612-83-320-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
517 $1.48
612 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C