Sockets for ICs, Transistors

Product List

21968 Items

Mfr Part #	Quantity Available	UnitPrice	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
146-83-314-41-035101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	277	$1.44	146	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
146-83-314-41-036101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	574	$1.45	146	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-314-41-007101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	145	$1.43	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-328-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	325	$1.44	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-83-318-31-012101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	66	$1.45	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
540-88-068-17-400-2 CONN SOCKET PLCC 68POS TIN Preci-Dip	329	$1.65	540	Bulk	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Board Guide, Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-
115-83-624-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	334	$1.45	115	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-316-41-009101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	223	$1.43	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-324-41-117101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	539	$1.45	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-324-41-134161 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	10	$1.42	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-424-41-117101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	117	$1.44	114	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-318-41-018101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	60	$1.44	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-83-320-41-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	79	$1.43	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-83-420-41-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	262	$1.42	614	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SMPX-52LCC-N SMT PLCC SOCKET 52P NON POLARISE Kycon, Inc.	168	$1.41	SMPX	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-50°C ~ 105°C
SMPX-52LCC-P SMT PLCC SOCKET 52P POLARISED RO Kycon, Inc.	9	$1.37	SMPX	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Board Guide, Closed Frame	Solder	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-50°C ~ 105°C
110-83-316-41-105191 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	61	$1.46	110	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-314-41-002101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	380	$1.43	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-312-41-001101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	527	$1.45	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-424-41-018101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	445	$1.46	116	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C