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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110
$1.66
8400
Tube
Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
168
$1.75
940
Tube
Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514
$1.72
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
323
$1.78
917
Tube
Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
532
$1.77
917
Tube
Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
47
$1.79
115
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
480
$1.82
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
534
$1.84
518
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
424
$1.82
Lo-PRO®file, 513
Bulk
Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
530
$1.86
917
Tube
Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
393
$1.86
8400
Tube
Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
4
$1.87
D2
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3), 2 Loaded 0.200" (5.08mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.200" (5.08mm) Tin 196.9µin (5.00µm) Brass Polyamide (PA), Nylon, Glass Filled -55°C ~ 125°C
277
$1.86
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
410
$1.86
Tube
Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
57
$1.95
110
Tube
Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
63
$1.91
940
Tube
Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
152
$1.96
Bulk
Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
342
$2.01
518
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
243
$2.07
111
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
157
$2.07
940
Tube
Active PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C