0
My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
8444-21B1-RK-TP
8444-21B1-RK-TP
CONN SOCKET PLCC 44POS TIN
3M
 330 $2.08
8400 Tube ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
110-87-632-41-001101
110-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 172 $2.23
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
940-44-028-24-000000
940-44-028-24-000000
CONN SOCKET PLCC 28POS TIN
Mill-Max Manufacturing Corp.
 39 $2.13
940 Tube ActivePLCC28 (4 x 7)0.100" (2.54mm)Tin150.0µin (3.81µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
8452-21A1-RK-TP
8452-21A1-RK-TP
CONN SOCKET PLCC 52POS TIN
3M
 24 $2.18
8400 Tube ActivePLCC52 (4 x 13)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
4601
4601
CONN TRANSIST TO-3 3POS TIN
Keystone Electronics
 97 $2.21
Bulk ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
10-3513-10
10-3513-10
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 284 $2.26
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
110-43-422-41-001000
110-43-422-41-001000
CONN IC DIP SOCKET 22POS GOLD
Mill-Max Manufacturing Corp.
 86 $2.26
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
PLCC-68-AT
PLCC-68-AT
PLCC 68P THROUGH HOLE
Adam Tech
 397 $2.21
PLCC Tube ActivePLCC68 (4 x 17)0.050" (1.27mm)Tin80.0µin (2.03µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin80.0µin (2.03µm)Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 105°C
8452-21B1-RK-TP
8452-21B1-RK-TP
CONN SOCKET PLCC 52POS TIN
3M
 147 $2.29
8400 Tube ActivePLCC52 (4 x 13)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
8468-21B1-RK-TR
8468-21B1-RK-TR
CONN SOCKET PLCC 68POS TIN
3M
 146 $2.96
8400 Tape & Reel (TR) ActivePLCC68 (4 x 17)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
8452-11B1-RK-TP
8452-11B1-RK-TP
CONN SOCKET PLCC 52POS TIN
3M
 55 $2.38
8400 Tube ActivePLCC52 (4 x 13)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyThrough HoleClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
110-43-324-41-001000
110-43-324-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 232 $2.40
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
54020-44030LF
54020-44030LF
CONN SOCKET PLCC 44POS TIN
Amphenol ICC (FCI)
 247 $2.53
Tube ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin100.0µin (2.54µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin100.0µin (2.54µm)Copper AlloyPolyphenylene Sulfide (PPS)-40°C ~ 105°C
8468-21B1-RK-TP
8468-21B1-RK-TP
CONN SOCKET PLCC 68POS TIN
3M
 334 $2.54
8400 Tube ActivePLCC68 (4 x 17)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
8468-11B1-RK-TP
8468-11B1-RK-TP
CONN SOCKET PLCC 68POS TIN
3M
 294 $2.61
8400 Tube ActivePLCC68 (4 x 17)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyThrough HoleClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
110-44-648-41-001000
110-44-648-41-001000
CONN IC DIP SOCKET 48POS TIN
Mill-Max Manufacturing Corp.
 297 $2.58
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
ICO-308-SGT
ICO-308-SGT
CONN IC DIP SOCKET 8POS GOLD
Samtec Inc.
 316 $2.68
ICO Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
XR2A-1401-N
XR2A-1401-N
CONN IC DIP SOCKET 14POS GOLD
Omron Electronics Inc-EMC Div
 22 $2.70
XR2 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
210-93-628-41-001000
210-93-628-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 167 $2.64
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-43-628-41-001000
210-43-628-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 24 $2.68
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C