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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
214
$0.00
Bulk
Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Brass Thermoplastic -
380
$0.00
Bulk
Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Brass Thermoplastic -
410
$0.00
Bulk
Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
91
$0.00
Tube
Active SIP 20 (1 x 20) - - - - - - - - - - - - -
350
$0.00
Tube
Active - - - - - - - - - - - - - - -
344
$0.00
800
Tube
Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
308
$0.00
Bulk
Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass - -
262
$0.00
Tube
Active - - - - - - - - - - - - - - -
326
$0.00
Tray
Active LGA 1567 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
143
$0.00
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
292
$0.00
Tape & Reel (TR)
Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
584
$0.00
500
Bulk
Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
576
$0.00
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Press-Fit 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
214
$0.00
Bulk
Active - - - - - - - - - - - - - - -
585
$0.00
Tube
Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
111
$0.00
500
Bulk
Obsolete DIP, 0.4" (10.16mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
204
$2.78
Bulk
Obsolete LGA 1151 0.036" (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.036" (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
128
$0.00
Bulk
Active - - - - - - - - - - - - - - -
421
$0.00
Bulk
Active - - - - - - - - - - - - - - -
43
$6.19
Bulk
Active SIP 10 (1 x 10) - - - - - - - - - - - - -