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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
357
$0.00
Bulk
Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
326
$0.00
Bulk
Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Phenolic -55°C ~ 125°C
494
$0.00
Bulk
Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
365
$0.00
Bulk
Active Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
605
$0.00
500
Bulk
Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
332
$0.00
800
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Thermoplastic, Polyester -
175
$0.00
800
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
257
$0.00
800
Bulk
Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
217
$0.00
Bulk
Active Transistor, TO-5 - - - - - - Closed Frame - - - - - - -
525
$0.00
Bulk
Active Transistor, TO-5 - - - - - - Closed Frame - - - - - - -
142
$0.00
8059
Bulk
Obsolete Transistor, TO-5 8 (Round) - Gold - - Through Hole Closed Frame Solder - Gold - - - -
278
$0.00
Bulk
Active - - - - - - - - - - - - - - -
317
$0.00
Bulk
Obsolete PGA 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 30.0µin (0.76µm) Brass Thermoplastic, Polyester -
441
$0.00
800
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
4
$22.41
Bulk
Obsolete - - - - - - - - - - - - - - -
299
$0.00
Bulk
Active Transistor, TO-5 20 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Fluoropolymer (FP) -55°C ~ 125°C
446
$0.00
510
Tube
Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
302
$0.00
Tube
Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 30.0µin (0.76µm) Brass Thermoplastic -
432
$0.00
Tube
Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 25.0µin (0.63µm) Brass - -
599
$0.00
Bulk
Active SIP 5 (1 x 5) - - - - - - - - - - - - -