Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-93-064-08-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$25.53		510	Bulk	Active	PGA	64 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-064-10-051002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$24.87		510	Bulk	Active	PGA	64 (10 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-064-10-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	21	$25.33		510	Bulk	Active	PGA	64 (10 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-952-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$25.33			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-952-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$25.08			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-632-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	25	$24.87			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-632-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	33	$25.52			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	30-9503-21 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	39	$25.11		503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	30-9503-31 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	5	$25.02		503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	84-PGM11010-40 CONN SOCKET PGA GOLD Aries Electronics	38	$25.62		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	116-43-648-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$25.24			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-648-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$25.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	32-3503-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3	$25.03		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	32-3503-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	27	$25.27		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	35-0508-21 CONN SOCKET SIP 35POS GOLD Aries Electronics	5	$25.23		508	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	35-0508-31 CONN SOCKET SIP 35POS GOLD Aries Electronics	28	$25.24		508	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	116-43-636-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$25.21			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-636-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	19	$25.10			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-13-044-08-031001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$24.98		510	Tube	Active	PGA	44 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-13-044-08-031002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	18	$25.02		510	Bulk	Active	PGA	44 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C