Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-91-092-11-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	31	$25.27		510	Bulk	Active	PGA	92 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-092-11-041003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$25.34		510	Bulk	Active	PGA	92 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	122-11-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$25.18		122	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	32-6574-11 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	33	$25.17		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6572-11 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	12	$24.74		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	50-9518-10E CONN IC DIP SOCKET 50POS GOLD Aries Electronics	28	$25.11		518	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	32-6503-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	19	$24.84		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	32-6503-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	20	$25.09		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	110-13-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$25.06			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	517-83-428-19-101111 CONN SOCKET PGA 428POS GOLD Preci-Dip	32	$25.98		517	Bulk	Active	PGA	428 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	123-13-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	30	$25.07		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	22-4508-21 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	25	$25.00		508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	22-4508-31 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	37	$25.01		508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	111-43-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	34	$25.35			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	19	$25.45			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	514-87-292M20-001148 CONN SOCKET BGA 292POS GOLD Preci-Dip	38	$26.14		514	Bulk	Active	BGA	292 (20 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	517-83-429-19-101111 CONN SOCKET PGA 429POS GOLD Preci-Dip	16	$25.99		517	Bulk	Active	PGA	429 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-93-064-10-051001 SOCKET SOLDERTAIL 64-PGA Mill-Max Manufacturing Corp.	18	$25.38		510	Bulk	Active	PGA	64 (10 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-064-08-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	24	$25.49		510	Bulk	Active	PGA	64 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-064-08-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3	$25.35		510	Bulk	Active	PGA	64 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C