Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-91-089-13-061001 SOCKET SOLDERTAIL 89-PGA Mill-Max Manufacturing Corp.	31	$25.03		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-12-051002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	33	$24.44		510	Bulk	Active	PGA	89 (12 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-12-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	14	$24.49		510	Bulk	Active	PGA	89 (12 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-13-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	39	$24.61		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-13-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	41	$24.92		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-13-082002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	13	$24.55		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-13-082003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$24.55		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-089-13-082001 SOCKET SOLDERTAIL 89-PGA Mill-Max Manufacturing Corp.	36	$24.71		510	Bulk	Active	PGA	89 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	28-3575-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	25	$24.87		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-6575-11 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	18	$24.72		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	116-43-642-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$25.07			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-642-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$24.59			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	32-3574-11 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	11	$24.54		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
	110-43-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$24.87			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$25.10			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-652-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	34	$25.08			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-952-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$24.89			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-652-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$24.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-952-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$25.17			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	326-93-164-41-002000 SOCKET WRAP SOLDERTAIL SIP 64POS Mill-Max Manufacturing Corp.	27	$25.21		326	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C