Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	116-93-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$24.75			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-628-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$24.39			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	48-6508-20 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2	$24.80		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	48-6508-30 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	5	$24.44		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	34-0508-21 CONN SOCKET SIP 34POS GOLD Aries Electronics	27	$24.51		508	Bulk	Active	SIP	34 (1 x 34)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	34-0508-31 CONN SOCKET SIP 34POS GOLD Aries Electronics	6	$24.65		508	Bulk	Active	SIP	34 (1 x 34)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	34-1508-21 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	22	$24.69		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	34-1508-31 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	21	$24.66		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	110-13-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$24.77			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-650-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$24.58			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-950-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$24.56			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-650-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	22	$24.45			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-950-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	25	$24.66			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-13-324-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$24.52			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	126-41-964-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	13	$24.94		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-91-964-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	33	$24.91		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	517-83-419-19-111111 CONN SOCKET PGA 419POS GOLD Preci-Dip	23	$25.60		517	Bulk	Active	PGA	419 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-93-059-11-001001 SOCKET SOLDERTAIL 59-PGA Mill-Max Manufacturing Corp.	25	$24.99		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-059-11-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	4	$24.46		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-059-11-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3	$25.00		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C