Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-91-640-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	34	$20.78			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-316-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$20.77			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-316-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$20.50			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	36-6556-11 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	9	$20.99		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	18-3508-21 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	38	$20.61		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	18-3508-31 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	4	$20.47		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	517-87-545-17-000111 CONN SOCKET PGA 545POS GOLD Preci-Dip	16	$21.44		517	Bulk	Active	PGA	545 (17 x 17)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	111-43-322-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	27	$20.72			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-43-422-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$20.91			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-322-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	40	$20.93			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-422-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	13	$20.70			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	121-11-950-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	25	$20.63		121	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$20.71			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	29	$20.42			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$20.43			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	15	$20.72			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$20.48			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	40	$20.84			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	65-PGM10008-11 CONN SOCKET PGA GOLD Aries Electronics	3	$20.98		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	116-93-964-41-007000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	22	$20.47		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C