Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	605-43-964-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	15	$20.60		605	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-47-950-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	29	$20.37		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-41-652-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$20.79		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-41-952-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.90		124	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-91-652-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.46		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-91-952-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$20.53		124	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	25-0511-11 CONN SOCKET SIP 25POS GOLD Aries Electronics	13	$20.79		511	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	24-0511-11 CONN SOCKET SIP 24POS GOLD Aries Electronics	9	$20.56		511	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	110-44-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	45	$20.88			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-99-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	43	$20.73			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-324-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$20.72			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-624-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	45	$20.52			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-324-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	49	$20.59			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-41-636-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$20.76			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-636-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$20.38			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	514-87-257-20-111117 CONN SOCKET PGA 257POS GOLD Preci-Dip	25	$21.57		514	Bulk	Active	PGA	257 (20 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	35-71000-10 CONN SOCKET SIP 35POS TIN Aries Electronics	13	$20.73		700 Elevator Strip-Line™	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	35-7360-10 CONN SOCKET SIP 35POS TIN Aries Electronics	48	$20.87		700 Elevator Strip-Line™	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	40-823-90C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	16	$20.68		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	122-13-648-41-001000 CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp.	2	$20.84		122	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C