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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
FMC05DRTN-S1682
FMC05DRTN-S1682
CONN TRANSIST TO-220/TO-247 5POS
Sullins Connector Solutions
 61 $15.78
Tray ActiveTransistor, TO-220 and TO-2475 (Rectangular)-Gold30.0µin (0.76µm)Nickel BoronThrough Hole-Solder-Gold30.0µin (0.76µm)Nickel BoronPolyphenylene Sulfide (PPS)-65°C ~ 200°C
28-526-11
28-526-11
CONN IC DIP SOCKET ZIF 28POS GLD
Aries Electronics
 51 $18.44
Lo-PRO®file, 526 Bulk ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
209-PGM17020-10
209-PGM17020-10
CONN SOCKET PGA GOLD
Aries Electronics
 45 $20.34
PGM Bulk ActivePGA-0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
232-1285-00-0602J
232-1285-00-0602J
CONN IC DIP SOCKET ZIF 32POS GLD
3M
 6 $25.11
Textool™ Tube ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
242-1281-00-0602J
242-1281-00-0602J
CONN IC DIP SOCKET ZIF 42POS GLD
3M
 32 $27.90
Textool™ Tube ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
256-1292-00-0602J
256-1292-00-0602J
CONN IC DIP SOCKET ZIF 56POS GLD
3M
 5 $42.88
Textool™ Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing56 (2 x 28)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
228-7396-55-1902
228-7396-55-1902
CONN SOCKET SOIC 28POS GOLD
3M
 21 $46.66
Textool™ Bulk ActiveSOIC28 (2 x 14)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30.0µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
232-2601-00-0602
232-2601-00-0602
CONN SOCKET SIP ZIF 32POS GOLD
3M
 4 $53.02
Textool™ Bulk ActiveSIP, ZIF (ZIP)32 (1 x 32)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
236-6225-00-0602
236-6225-00-0602
CONN SOCKET SIP ZIF 36POS GOLD
3M
 3 $55.29
Textool™ Bulk ActiveSIP, ZIF (ZIP)36 (1 x 36)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
216-5205-01
216-5205-01
CONN SOCKET QFN 16POS GOLD
3M
 5 $92.25
Textool™ Bulk ActiveQFN16 (3x3)0.020" (0.50mm)Gold-Beryllium CopperThrough Hole-Solder-Gold-Beryllium CopperPolyethersulfone (PES)-
44-547-11
44-547-11
CONN SOCKET SOIC ZIF 44POS GOLD
Aries Electronics
 5 $212.92
547 Bulk ActiveSOIC, ZIF (ZIP)44 (2 x 22)-Gold20.0µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold20.0µin (0.51µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
84-537-21
84-537-21
CONN SOCKET PLCC ZIF 84POS GOLD
Aries Electronics
 2 $313.13
537 - ActivePLCC, ZIF (ZIP)84 (4 x 21)0.100" (2.54mm)Gold12.0µin (0.30µm)-Surface MountClosed Frame-------
317-47-108-41-005000
317-47-108-41-005000
CONN SOCKET SIP 8POS GOLD
Mill-Max Manufacturing Corp.
 258 $1.32
317 Tube ActiveSIP8 (1 x 8)0.070" (1.78mm)GoldFlashBeryllium CopperThrough Hole-Solder0.070" (1.78mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-99-424-41-001000
110-99-424-41-001000
CONN IC DIP SOCKET 24POS TINLEAD
Mill-Max Manufacturing Corp.
 486 $1.40
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-47-318-41-003000
115-47-318-41-003000
CONN IC DIP SOCKET 18POS GOLD
Mill-Max Manufacturing Corp.
 27 $1.50
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-47-628-41-001000
210-47-628-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 263 $1.82
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-210-10-001000
110-43-210-10-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 445 $1.84
110 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5), 6 Loaded0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-318-01-670800
214-99-318-01-670800
CONN IC DIP SOCKET 18POS TINLEAD
Mill-Max Manufacturing Corp.
 253 $2.23
214 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
317-47-121-41-005000
317-47-121-41-005000
CONN SOCKET SIP 21POS GOLD
Mill-Max Manufacturing Corp.
 131 $2.50
317 Tube ActiveSIP21 (1 x 21)0.070" (1.78mm)GoldFlashBeryllium CopperThrough Hole-Solder0.070" (1.78mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-318-41-001000
115-43-318-41-001000
CONN IC DIP SOCKET 18POS GOLD
Mill-Max Manufacturing Corp.
 396 $2.47
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C