0
My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
299-43-608-10-002000
299-43-608-10-002000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
 37 $6.61
299 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-43-328-41-001000
123-43-328-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 129 $6.62
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-93-328-41-001000
123-93-328-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 44 $6.73
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-93-628-41-001000
123-93-628-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 95 $6.59
123 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-632-31-012000
614-93-632-31-012000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 75 $6.84
614 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
299-43-610-10-002000
299-43-610-10-002000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 137 $7.02
299 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
APO-308-G-H
APO-308-G-H
CONN DIP ADAPT 8POS
Samtec Inc.
 72 $7.24
APO Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-
123-93-632-41-001000
123-93-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 27 $7.67
123 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-823-90
08-823-90
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 20 $8.06
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
299-93-320-10-001000
299-93-320-10-001000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
 7 $8.29
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-810-90
08-810-90
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 61 $8.09
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
25-0511-10
25-0511-10
CONN SOCKET SIP 25POS TIN
Aries Electronics
 6 $7.95
511 Tube ActiveSIP25 (1 x 25)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
ICO-640-SGT
ICO-640-SGT
CONN IC DIP SOCKET 40POS GOLD
Samtec Inc.
 30 $9.46
ICO Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
117-43-764-41-005000
117-43-764-41-005000
CONN IC DIP SOCKET 64POS GOLD
Mill-Max Manufacturing Corp.
 82 $9.64
117 Tube ActiveDIP, 0.75" (19.05mm) Row Spacing64 (2 x 32)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
16-823-90
16-823-90
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 30 $10.54
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
110-43-640-41-801000
110-43-640-41-801000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
 73 $10.97
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
20-820-90C
20-820-90C
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 54 $12.54
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
16-810-90C
16-810-90C
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 28 $12.44
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
110-13-640-41-801000
110-13-640-41-801000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
 36 $12.46
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
714-43-264-31-018000
714-43-264-31-018000
CONN IC DIP SOCKET 64POS GOLD
Mill-Max Manufacturing Corp.
 25 $15.28
714 Tube ActiveDIP, 0.1" (2.54mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Closed FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C