Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	214-99-318-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	134	$3.64		214	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	110-83-642-41-105161 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	166	$3.80		110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	4594 CONN SOCKET TRANSIST TO100 10POS Keystone Electronics	180	$3.68			Bulk	Active	Transistor, TO-100	10 (Round)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
	110-83-628-41-105191 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	225	$3.83		110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	116-87-318-41-013101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	130	$3.85		116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	299-83-320-11-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	166	$3.79		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-87-124-13-001101 CONN SOCKET PGA 124POS GOLD Preci-Dip	179	$3.80		510	Bulk	Active	PGA	124 (13 x 13)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-87-124-13-041101 CONN SOCKET PGA 124POS GOLD Preci-Dip	91	$3.85		510	Bulk	Active	PGA	124 (13 x 13)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	14-0513-11 CONN SOCKET SIP 14POS GOLD Aries Electronics	103	$3.63		0513	Bulk	Active	SIP	14 (1 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	16-0513-10H CONN SOCKET SIP 16POS GOLD Aries Electronics	30	$3.71		0513	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	06-3518-01 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	162	$3.65		518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	29-0518-10T CONN SOCKET SIP 29POS GOLD Aries Electronics	116	$3.66		518	Bulk	Active	SIP	29 (1 x 29)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	32-0518-10 CONN SOCKET SIP 32POS GOLD Aries Electronics	206	$3.71		518	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	32-1518-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	166	$3.71		518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	04-0508-21 CONN SOCKET SIP 4POS GOLD Aries Electronics	219	$3.67		508	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	04-0508-31 CONN SOCKET SIP 4POS GOLD Aries Electronics	240	$3.68		508	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	04-1508-21 CONN IC DIP SOCKET 4POS GOLD Aries Electronics	167	$3.73		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	04-1508-31 CONN IC DIP SOCKET 4POS GOLD Aries Electronics	194	$3.63		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	214-99-320-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	30	$3.64		214	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	214-44-320-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	147	$3.63		214	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C