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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
510-83-072-11-001101
510-83-072-11-001101
CONN SOCKET PGA 72POS GOLD
Preci-Dip
 245 $3.78
510 Bulk ActivePGA72 (11 x 11)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-072-11-041101
510-83-072-11-041101
CONN SOCKET PGA 72POS GOLD
Preci-Dip
 226 $3.70
510 Bulk ActivePGA72 (11 x 11)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-072-11-061101
510-83-072-11-061101
CONN SOCKET PGA 72POS GOLD
Preci-Dip
 234 $3.75
510 Bulk ActivePGA72 (11 x 11)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-640-41-018101
116-83-640-41-018101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
 28 $3.70
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-642-41-006101
116-83-642-41-006101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
 2 $3.74
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
10-2513-10H
10-2513-10H
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 25 $3.66
Lo-PRO®file, 513 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-3513-10H
10-3513-10H
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 175 $3.62
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
22-4513-10
22-4513-10
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 90 $3.66
Lo-PRO®file, 513 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
14-0513-11H
14-0513-11H
CONN SOCKET SIP 14POS GOLD
Aries Electronics
 127 $3.61
0513 Bulk ActiveSIP14 (1 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
22-0513-10
22-0513-10
CONN SOCKET SIP 22POS GOLD
Aries Electronics
 231 $3.57
0513 Bulk ActiveSIP22 (1 x 22)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
16-3513-00
16-3513-00
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 225 $3.60
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
116-87-636-41-009101
116-87-636-41-009101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
 4 $3.82
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-652-41-003101
116-87-652-41-003101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
 205 $3.75
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
14-6513-11
14-6513-11
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
 208 $3.62
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
06-3503-20
06-3503-20
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
 114 $3.58
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
06-3503-30
06-3503-30
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
 17 $3.66
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
22-4518-00
22-4518-00
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 104 $3.63
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-6513-10T
24-6513-10T
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 171 $3.65
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
510-83-073-11-061101
510-83-073-11-061101
CONN SOCKET PGA 73POS GOLD
Preci-Dip
 122 $3.85
510 Bulk ActivePGA73 (11 x 11)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
214-44-318-01-670799
214-44-318-01-670799
STANDRD SOLDER TAIL DIP SOCKET
Mill-Max Manufacturing Corp.
 53 $3.70
214 Tape & Reel (TR) ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolyamide (PA46), Nylon 4/6-55°C ~ 125°C