0
My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
346-43-117-41-013000
346-43-117-41-013000
CONN SOCKET SIP 17POS GOLD
Mill-Max Manufacturing Corp.
 176 $3.36
346 Bulk ActiveSIP17 (1 x 17)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
612-83-640-41-001101
612-83-640-41-001101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
 249 $3.49
612 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-87-964-41-005101
110-87-964-41-005101
CONN IC DIP SOCKET 64POS GOLD
Preci-Dip
 73 $3.49
110 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing64 (2 x 32)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
APA-320-T-J
APA-320-T-J
ADAPTER PLUG
Samtec Inc.
 273 $3.37
APA Tube Active-20 (2 x 10)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-
117-83-656-41-005101
117-83-656-41-005101
CONN IC DIP SOCKET 56POS GOLD
Preci-Dip
 60 $3.51
117 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing56 (2 x 28)0.070" (1.78mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-628-41-008101
116-83-628-41-008101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 185 $3.48
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-428-41-008101
116-83-428-41-008101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 131 $3.44
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-642-41-012101
116-87-642-41-012101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
 244 $3.46
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
18-3511-10
18-3511-10
CONN IC DIP SOCKET 18POS TIN
Aries Electronics
 47 $3.36
511 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
116-87-328-41-011101
116-87-328-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 74 $3.46
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-428-41-011101
116-87-428-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 133 $3.53
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-628-41-011101
116-87-628-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 152 $3.52
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-320-41-004101
116-83-320-41-004101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
 270 $3.53
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-420-41-004101
116-83-420-41-004101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
 78 $3.49
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
08-2513-11H
08-2513-11H
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 181 $3.39
Lo-PRO®file, 513 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
29-0518-10
29-0518-10
CONN SOCKET SIP 29POS GOLD
Aries Electronics
 41 $3.32
518 Bulk ActiveSIP29 (1 x 29)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
07-0508-20
07-0508-20
CONN SOCKET SIP 7POS GOLD
Aries Electronics
 16 $3.37
508 Bulk ActiveSIP7 (1 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
07-0508-30
07-0508-30
CONN SOCKET SIP 7POS GOLD
Aries Electronics
 227 $3.36
508 Bulk ActiveSIP7 (1 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
116-87-648-41-003101
116-87-648-41-003101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
 28 $3.47
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-83-648-41-003101
115-83-648-41-003101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
 255 $3.50
115 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C