Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
116-87-324-41-004101
116-87-324-41-004101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
113 $3.41
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-424-41-004101
116-87-424-41-004101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
142 $3.38
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-640-41-105101
110-83-640-41-105101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
223 $3.41
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
614-87-648-31-012101
614-87-648-31-012101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
82 $3.39
614 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-650-41-018101
116-87-650-41-018101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
103 $3.42
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
XR2T-1621-N
XR2T-1621-N
CONN IC DIP SOCKET 16POS GOLD
Omron Electronics Inc-EMC Div
54 $3.27
XR2 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
123-83-324-41-001101
123-83-324-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
59 $3.45
123 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
117-87-648-41-105101
117-87-648-41-105101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
72 $3.39
117 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.070" (1.78mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
06-6513-11H
06-6513-11H
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
261 $3.32
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-9513-10T
10-9513-10T
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
97 $3.32
Lo-PRO®file, 513 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
20-3518-00
20-3518-00
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
73 $3.31
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
20-4518-00
20-4518-00
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
198 $3.27
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-0518-10H
24-0518-10H
CONN SOCKET SIP 24POS GOLD
Aries Electronics
115 $3.29
518 Bulk ActiveSIP24 (1 x 24)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-1518-10H
24-1518-10H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
87 $3.27
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-83-318-11-001101
299-83-318-11-001101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
4 $3.42
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-652-41-005101
110-83-652-41-005101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
170 $3.44
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
18-3518-11
18-3518-11
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
49 $3.29
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
214-44-314-01-670799
214-44-314-01-670799
STANDRD SOLDER TAIL DIP SOCKET
Mill-Max Manufacturing Corp.
223 $3.33
214 Tape & Reel (TR) ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
214-99-314-01-670799
214-99-314-01-670799
STANDRD SOLDER TAIL DIP SOCKET
Mill-Max Manufacturing Corp.
228 $3.34
214 Tape & Reel (TR) ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
346-93-117-41-013000
346-93-117-41-013000
CONN SOCKET SIP 17POS GOLD
Mill-Max Manufacturing Corp.
243 $3.32
346 Bulk ActiveSIP17 (1 x 17)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C