TMS5700714APGEQQ1R
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Texas Instruments TMS5700714APGEQQ1R

Manufacturer No:
TMS5700714APGEQQ1R
Manufacturer:
Texas Instruments
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 768KB FLASH 144LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS570LS0714APGEQQ1R is a high-performance automotive-grade microcontroller (MCU) from Texas Instruments, part of the Hercules TMS570 series. This MCU is designed for safety-critical applications and features a dual CPU architecture running in lockstep, ensuring high reliability and fault tolerance. The device is based on the ARM Cortex-R4F 32-bit RISC CPU, which provides efficient processing with up to 265 DMIPS at 160 MHz. It supports ISO 26262 and IEC 61508 functional safety standards, making it ideal for various automotive and industrial applications.

Key Specifications

Parameter Specification
Processor ARM Cortex-R4F 32-bit RISC CPU
System Clock Up to 160 MHz
Core Supply Voltage (VCC) 1.14 to 1.32 V
I/O Supply Voltage (VCCIO) 3.0 to 3.6 V
Integrated Memory 768KB Flash with ECC, 128KB RAM with ECC, 64KB Flash for Emulated EEPROM with ECC
Memory Protection 12-Region Memory Protection Unit (MPU)
Interrupt Module 128-Channel Vectored Interrupt Module (VIM)
DMA Controller 16 Channels and 32 Peripheral Requests
Timer Modules Two Next Generation High-End Timer (N2HET) Modules
Analog-to-Digital Converters (ADCs) Two 12-Bit Multibuffered ADC Modules (24 and 16 channels)
Communication Interfaces Up to Three CAN Controllers, I2C, 3 Multibuffered Serial Peripheral Interfaces (MibSPIs), One Standard SPI Module, Two UART (SCI) Interfaces
General-Purpose I/O (GIO) Pins Up to 64 GIO Pins, with up to 16 GIO Pins with interrupt generation capability
Packages 144-Pin Quad Flatpack (PGE) [Green], 100-Pin Quad Flatpack (PZ) [Green]

Key Features

  • Dual CPUs running in lockstep for enhanced reliability and fault tolerance.
  • Error Correction Code (ECC) on flash and RAM interfaces.
  • Built-In Self-Test (BIST) for CPU and on-chip RAMs.
  • Error signaling module with error pin and voltage and clock monitoring.
  • Floating-point unit (FPU) with single and double precision.
  • Enhanced timing peripherals including ePWM, eCAP, eQEP, and N2HET modules.
  • Multiple communication interfaces such as CAN, I2C, SPI, and UART.
  • Advanced JTAG security module (AJSM) and IEEE 1149.1 JTAG, boundary scan, and ARM CoreSight components.
  • Integrated functional safety features compliant with ISO 26262 and IEC 61508 standards.

Applications

  • Electric Power Steering (EPS) and braking systems (ABS and ESC).
  • Hybrid Electric Vehicle (HEV) and Electric Vehicle (EV) inverter systems.
  • Battery-management systems.
  • Active driver assistance systems.
  • Aerospace and avionics.
  • Railway communications.
  • Off-road vehicles.

Q & A

  1. What is the primary application of the TMS570LS0714APGEQQ1R MCU?

    The TMS570LS0714APGEQQ1R is primarily used in safety-critical automotive and industrial applications.

  2. What CPU architecture does the TMS570LS0714APGEQQ1R use?

    The device is based on the ARM Cortex-R4F 32-bit RISC CPU.

  3. What is the maximum system clock frequency of the TMS570LS0714APGEQQ1R?

    The maximum system clock frequency is up to 160 MHz.

  4. What type of memory protection does the TMS570LS0714APGEQQ1R have?

    The device features a 12-Region Memory Protection Unit (MPU).

  5. Does the TMS570LS0714APGEQQ1R support functional safety standards?

    Yes, it supports ISO 26262 and IEC 61508 functional safety standards.

  6. What are the key peripherals included in the TMS570LS0714APGEQQ1R?

    The device includes ePWM, eCAP, eQEP, N2HET modules, and multiple communication interfaces like CAN, I2C, SPI, and UART.

  7. How many general-purpose I/O pins does the TMS570LS0714APGEQQ1R have?

    The device has up to 64 general-purpose I/O (GIO) pins, with up to 16 GIO pins capable of generating interrupts.

  8. What is the purpose of the dual CPUs running in lockstep?

    The dual CPUs running in lockstep enhance reliability and fault tolerance by allowing the system to continue operating even if one CPU fails.

  9. Does the TMS570LS0714APGEQQ1R have built-in self-test capabilities?

    Yes, the device includes Built-In Self-Test (BIST) for CPU and on-chip RAMs.

  10. What types of packages are available for the TMS570LS0714APGEQQ1R?

    The device is available in 144-Pin Quad Flatpack (PGE) and 100-Pin Quad Flatpack (PZ) packages.

Product Attributes

Core Processor:ARM® Cortex®-R4F
Core Size:32-Bit Dual-Core
Speed:160MHz
Connectivity:CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:DMA, POR, PWM, WDT
Number of I/O:64
Program Memory Size:768KB (768K x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:128K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 3.6V
Data Converters:A/D 24x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
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Similar Products

Part Number TMS5700714APGEQQ1R TMS5700714APGEQQ1
Manufacturer Texas Instruments Texas Instruments
Product Status Active Active
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Speed 160MHz 160MHz
Connectivity CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 64 64
Program Memory Size 768KB (768K x 8) 768KB (768K x 8)
Program Memory Type Flash Flash
EEPROM Size 64K x 8 64K x 8
RAM Size 128K x 8 128K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V 1.14V ~ 3.6V
Data Converters A/D 24x12b A/D 24x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 144-LQFP 144-LQFP
Supplier Device Package 144-LQFP (20x20) 144-LQFP (20x20)

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