TMS5700714APGEQQ1
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Texas Instruments TMS5700714APGEQQ1

Manufacturer No:
TMS5700714APGEQQ1
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MCU 32BIT 768KB FLASH 144LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS570LS0714APGEQQ1 is a high-performance, automotive-grade microcontroller (MCU) from Texas Instruments, part of the Hercules TMS570 series. This MCU is based on the ARM Cortex-R4F floating-point CPU, offering efficient processing at up to 160 MHz and providing up to 265 DMIPS. It is designed for safety-critical applications and supports ISO 26262 and IEC 61508 functional safety standards. The device features comprehensive on-chip diagnostic capabilities, including dual CPUs in lockstep, CPU and memory Built-In Self-Test (BIST) logic, ECC on both flash and SRAM, and parity on peripheral memories.

Key Specifications

Parameter Specification
Processor ARM Cortex-R4F floating-point CPU
Operating Frequency Up to 160 MHz
Performance Up to 265 DMIPS
Memory 768KB integrated flash, 128KB RAM
Memory Protection ECC on flash and SRAM, parity on peripheral memories
Package 144-Pin Quad Flatpack (PGE)
Operating Temperature Range -40°C to 125°C
I/O Supply Voltage 3.3V
General-Purpose I/O (GIO) Pins Up to 64 GIO pins, up to 16 with interrupt generation capability

Key Features

  • Dual CPUs in lockstep for redundancy and safety
  • CPU and memory Built-In Self-Test (BIST) logic
  • Frequency-Modulated Phase-Locked Loop (FMPLL) with built-in slip detector
  • IEEE 1149.1 JTAG, boundary scan, and ARM CoreSight components
  • Advanced JTAG Security Module (AJSM)
  • Enhanced timing peripherals:
    • 7 Enhanced Pulse Width Modulator (ePWM) modules
    • 6 Enhanced Capture (eCAP) modules
    • 2 Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Two Next Generation High-End Timer (N2HET) modules
  • Two 12-bit multibuffered ADC modules with up to 24 channels
  • Multiple communication interfaces:
    • Up to three CAN controllers (DCANs)
    • Inter-Integrated Circuit (I²C)
    • Three multibuffered Serial Peripheral Interfaces (MibSPIs)
    • One standard Serial Peripheral Interface (SPI) module
    • Two UART (SCI) interfaces, one with Local Interconnect Network (LIN 2.1) interface support

Applications

The TMS570LS0714APGEQQ1 is ideal for high-performance, real-time control applications with safety-critical requirements, particularly in the automotive sector. It is well-suited for applications such as:

  • Automotive safety systems (e.g., airbag control, anti-lock braking systems)
  • Industrial control systems requiring high reliability and safety
  • Medical devices with stringent safety standards
  • Aerospace and defense applications needing robust and reliable control systems

Q & A

  1. What is the processor core used in the TMS570LS0714APGEQQ1?

    The TMS570LS0714APGEQQ1 uses the ARM Cortex-R4F floating-point CPU.

  2. What is the maximum operating frequency of the TMS570LS0714APGEQQ1?

    The maximum operating frequency is up to 160 MHz.

  3. How much integrated flash and RAM does the TMS570LS0714APGEQQ1 have?

    The device has 768KB of integrated flash and 128KB of RAM.

  4. What are the key safety features of the TMS570LS0714APGEQQ1?

    The device features dual CPUs in lockstep, CPU and memory BIST logic, ECC on flash and SRAM, and parity on peripheral memories.

  5. What types of communication interfaces are available on the TMS570LS0714APGEQQ1?

    The device includes CAN controllers, I²C, MibSPIs, SPI, and UART interfaces.

  6. What is the operating temperature range of the TMS570LS0714APGEQQ1?

    The operating temperature range is -40°C to 125°C.

  7. How many GIO pins does the TMS570LS0714APGEQQ1 have?

    The device has up to 64 GIO pins, with up to 16 capable of generating interrupts.

  8. What are the enhanced timing peripherals available on the TMS570LS0714APGEQQ1?

    The device includes ePWM, eCAP, eQEP, and N2HET modules.

  9. Is the TMS570LS0714APGEQQ1 compliant with any specific safety standards?

    Yes, it supports ISO 26262 and IEC 61508 functional safety standards.

  10. What development kit is recommended for evaluating the TMS570LS0714APGEQQ1?

    The Hercules TMS570 LaunchPad Development Kit is recommended.

Product Attributes

Core Processor:ARM® Cortex®-R4F
Core Size:32-Bit Dual-Core
Speed:160MHz
Connectivity:CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:DMA, POR, PWM, WDT
Number of I/O:64
Program Memory Size:768KB (768K x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:128K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 3.6V
Data Converters:A/D 24x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
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Similar Products

Part Number TMS5700714APGEQQ1 TMS5700914APGEQQ1 TMS5700714APGEQQ1R
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 32-Bit Dual-Core 16/32-Bit 32-Bit Dual-Core
Speed 160MHz 160MHz 160MHz
Connectivity CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, I²C, McBSP, SCI, SPI, UART/USART CANbus, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 64 64 64
Program Memory Size 768KB (768K x 8) 1MB (1M x 8) 768KB (768K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8
RAM Size 128K x 8 128K x 8 128K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V
Data Converters A/D 24x12b A/D 24x12b A/D 24x12b
Oscillator Type External External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 144-LQFP 144-LQFP 144-LQFP
Supplier Device Package 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)

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