TMS320DM6437ZDU4
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Texas Instruments TMS320DM6437ZDU4

Manufacturer No:
TMS320DM6437ZDU4
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DGTL MEDIA PROCESSOR 376-BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320DM6437ZDU4 is a high-performance digital media processor from Texas Instruments, part of the TMS320C6000™ DSP platform. This device is based on the third-generation advanced VelociTI™ very-long-instruction-word (VLIW) architecture, making it an excellent choice for digital media applications. The DM6437 is fully software-compatible with previous C64x devices and offers enhanced functionality and an expanded instruction set. It is designed to handle demanding tasks in video and imaging processing, networking, and other high-performance DSP applications.

Key Specifications

Feature Specification
Clock Rate 400-, 500-, 600-, 660-, 700-MHz
Instruction Cycle Time 2.5-, 2-, 1.67-, 1.51-, 1.43-ns
MIPS Performance Up to 5600 MIPS
L1P Program RAM/Cache 256K-Bit (32K-Byte), Flexible Allocation
L1D Data RAM/Cache 640K-Bit (80K-Byte), Flexible Allocation
L2 Unified RAM/Cache 1M-Bit (128K-Byte), Flexible Allocation
DDR2 Memory Controller 32-Bit, 256M-Byte Address Space (1.8-V I/O)
Asynchronous EMIF (EMIFA) 8-Bit Wide, up to 64M-Byte Address Reach
Flash Memory Interfaces NOR (8-Bit-Wide Data), NAND (8-Bit-Wide Data)
EDMA Controller 64 Independent Channels, 8 QDMA Channels
General-Purpose Timers Two 64-Bit (Configurable as Two 32-Bit Each)
Watch Dog Timer One 64-Bit
UARTs Two (One with RTS and CTS Flow Control)
I2C Bus Master/Slave
McBSPs Two Multichannel Buffered Serial Ports
Ethernet MAC (EMAC) 10/100 Mb/s, IEEE 802.3 Compliant
Package 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch

Key Features

  • High-Performance DSP Core: The TMS320DM6437 features the C64x+™ DSP core with up to 5600 MIPS performance at 700 MHz, supporting eight 32-bit instructions per cycle.
  • Video Processing Subsystem (VPSS): Includes Video Processing Front-End (VPFE) and Video Processing Back-End (VPBE) for advanced video and imaging processing.
  • Memory and Interfaces: Supports DDR2 SDRAM, asynchronous EMIF, NOR and NAND flash memory, and various serial and parallel interfaces like McBSPs, I2C, and UARTs.
  • Networking Capabilities: Features a 10/100 Mb/s Ethernet MAC (EMAC) with IEEE 802.3 compliance and Media Independent Interface (MII) support.
  • Peripheral Set: Includes high-end CAN controller, PCI interface, PWM outputs, and general-purpose timers.
  • Power Management: Offers individual power-savings modes and flexible PLL clock generators.
  • Development Tools: Comes with a complete set of development tools including C compilers, DSP assembly optimizer, and a Windows™ debugger interface.

Applications

  • Digital Video Products: Ideal for in-flight entertainment systems, IP net cameras, video phones, and vision systems.
  • Automotive Systems: Suitable for automotive applications due to its high-end CAN controller and robust peripheral set.
  • Networking and Surveillance: Used in IP-based network surveillance cameras and other networked video applications.
  • Audio and Video Encoding: Capable of performing H.264 video encoding at D1 resolution and handling complete video, audio, and networking for various applications.

Q & A

  1. What is the maximum clock rate of the TMS320DM6437ZDU4?

    The maximum clock rate is 700 MHz.

  2. What is the MIPS performance of the TMS320DM6437ZDU4?

    Up to 5600 MIPS.

  3. What type of memory interfaces does the TMS320DM6437ZDU4 support?

    DDR2 SDRAM, asynchronous EMIF, NOR and NAND flash memory.

  4. Does the TMS320DM6437ZDU4 support Ethernet?

    Yes, it supports 10/100 Mb/s Ethernet MAC (EMAC) with IEEE 802.3 compliance.

  5. What is the Video Processing Subsystem (VPSS) in the TMS320DM6437ZDU4?

    The VPSS includes the Video Processing Front-End (VPFE) and Video Processing Back-End (VPBE) for advanced video and imaging processing.

  6. What development tools are available for the TMS320DM6437ZDU4?

    C compilers, DSP assembly optimizer, and a Windows™ debugger interface.

  7. What is the package type and pin count of the TMS320DM6437ZDU4?

    376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch.

  8. Is the TMS320DM6437ZDU4 suitable for automotive applications?

    Yes, it is suitable due to its high-end CAN controller and robust peripheral set.

  9. Does the TMS320DM6437ZDU4 support power-saving modes?

    Yes, it offers individual power-savings modes and flexible PLL clock generators.

  10. What is the process technology used in the TMS320DM6437ZDU4?

    0.09 µm process technology.

Product Attributes

Type:Fixed Point
Interface:HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC
Clock Rate:400MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:240kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.05V, 1.20V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:376-BBGA Exposed Pad
Supplier Device Package:376-BGA (23x23)
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Similar Products

Part Number TMS320DM6437ZDU4 TMS320DM6437ZDU5 TMS320DM6437ZDU6 TMS320DM6437ZDUQ4 TMS320DM6437ZDU7 TMS320DM6437ZDUL TMS320DM6433ZDU4 TMS320DM6435ZDU4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Not For New Designs Active Not For New Designs Active Obsolete Obsolete Not For New Designs Obsolete
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate 400MHz 500MHz 600MHz 400MHz 700MHz 600MHz 400MHz 400MHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 240kB 240kB 240kB 240kB 240kB 240kB 240kB 240kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.20V 1.05V, 1.20V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23)

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