TMS320C6747CZKBD4
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Texas Instruments TMS320C6747CZKBD4

Manufacturer No:
TMS320C6747CZKBD4
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP FIXED/FLOAT POINT 256BGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The TMS320C6747CZKBD4 is a low-power digital signal processor (DSP) from Texas Instruments, based on the TMS320C674x DSP core. This device is part of the TMS320C6000™ platform and is designed to consume significantly lower power compared to other members of this family. It is tailored for applications requiring high processing performance and efficient power management. The TMS320C6747 enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with advanced signal processing capabilities.

Key Specifications

Specification Details
Processor Core TMS320C674x DSP core
Clock Speed Up to 375 MHz and 456 MHz
Performance Up to 3648 MIPS and 2736 MFLOPS
Cache Memory 32KB L1P Program Cache, 32KB L1D Data Cache, 256KB L2 Unified Cache
RAM 128KB of RAM shared memory (TMS320C6747 only)
Instruction Set Superset of C67x+ and C64x+ ISAs, byte-addressable (8-, 16-, 32-, and 64-bit data)
General-Purpose Registers 64 general-purpose registers (32-bit)
Functional Units Six ALU (32- and 40-bit) functional units
Floating Point Support Supports 32-bit integer, SP (IEEE Single Precision/32-bit), and DP (IEEE Double Precision/64-bit) floating point
External Memory Interfaces EMIFA and EMIFB with support for NOR, NAND, and SDRAM
UART Modules Three configurable 16550-Type UART modules
USB Interfaces USB 2.0 OTG port with integrated PHY, high-, full-, and low-speed host/client support
Audio Serial Ports Three multichannel audio serial ports (McASPs)
Ethernet MAC 10/100 Mbps Ethernet MAC (EMAC) with MDIO module
Package Type 256-Ball Pb-Free Plastic Ball Grid Array (PBGA)
Temperature Grade Commercial, Industrial, Extended, or Automotive

Key Features

  • Enhanced Direct Memory Access Controller 3 (EDMA3) with 2 transfer controllers, 32 independent DMA channels, and 8 quick DMA channels
  • Two-level cache memory architecture with flexible RAM/cache partition
  • Load-store architecture with nonaligned support and 64 general-purpose registers
  • Support for mixed-precision IEEE floating-point multiply operations
  • Instruction packing to reduce code size and all instructions are conditional
  • Hardware support for modulo loop operation and protected mode operation
  • Exceptions support for error detection and program redirection
  • Three enhanced pulse width modulators (eHRPWMs) and three 32-bit enhanced capture (eCAP) modules
  • Two 32-bit enhanced quadrature encoder pulse (eQEP) modules
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
  • Two master and slave Inter-Integrated Circuit (I2C Bus™) interfaces
  • Real-Time Clock with 32-kHz oscillator and separate power rail (TMS320C6747 only)
  • Programmable Real-Time Unit Subsystem (PRUSS) with two independent PRU cores

Applications

  • A/V Receivers
  • Automotive Amplifiers
  • Soundbars
  • Home Theatre Systems
  • Professional Audio
  • Network Streaming Audio

Q & A

  1. What is the TMS320C6747CZKBD4 processor core based on?

    The TMS320C6747CZKBD4 is based on the TMS320C674x DSP core.

  2. What are the clock speeds of the TMS320C6747CZKBD4?

    The TMS320C6747CZKBD4 operates at up to 375 MHz and 456 MHz.

  3. What is the performance of the TMS320C6747CZKBD4 in terms of MIPS and MFLOPS?

    The TMS320C6747CZKBD4 achieves up to 3648 MIPS and 2736 MFLOPS.

  4. What is the cache memory architecture of the TMS320C6747CZKBD4?

    The device features a two-level cache memory architecture with 32KB L1P and L1D caches and a 256KB L2 unified cache.

  5. Does the TMS320C6747CZKBD4 support floating-point operations?

    Yes, it supports 32-bit integer, SP (IEEE Single Precision/32-bit), and DP (IEEE Double Precision/64-bit) floating-point operations.

  6. What external memory interfaces are available on the TMS320C6747CZKBD4?

    The device includes EMIFA and EMIFB interfaces supporting NOR, NAND, and SDRAM.

  7. How many UART modules does the TMS320C6747CZKBD4 have?

    The device has three configurable 16550-Type UART modules.

  8. What USB capabilities does the TMS320C6747CZKBD4 offer?

    The device features a USB 2.0 OTG port with integrated PHY, supporting high-, full-, and low-speed host/client operations.

  9. What audio interfaces are available on the TMS320C6747CZKBD4?

    The device includes three multichannel audio serial ports (McASPs).

  10. Does the TMS320C6747CZKBD4 have Ethernet capabilities?

    Yes, it includes a 10/100 Mbps Ethernet MAC (EMAC) with an MDIO module.

Product Attributes

Type:Fixed/Floating Point
Interface:EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB
Clock Rate:456MHz
Non-Volatile Memory:External
On-Chip RAM:448kB
Voltage - I/O:3.30V
Voltage - Core:1.20V
Operating Temperature:-40°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:256-BGA
Supplier Device Package:256-BGA (17x17)
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Similar Products

Part Number TMS320C6747CZKBD4 TMS320C6747DZKBD4 TMS320C6747BZKBD4 TMS320C6747CZKB4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Obsolete Obsolete
Type Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB
Clock Rate 456MHz 456MHz 456MHz 456MHz
Non-Volatile Memory External External External External
On-Chip RAM 448kB 448kB 448kB 448kB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.20V 1.20V 1.20V 1.20V
Operating Temperature -40°C ~ 90°C (TJ) -40°C ~ 90°C (TJ) -40°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17)

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