TMS320C6472ECTZ7
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Texas Instruments TMS320C6472ECTZ7

Manufacturer No:
TMS320C6472ECTZ7
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP FIXED-POINT 737FCBGA
Delivery:
Payment:
iso14001
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iso9001
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Product Introduction

Overview

The TMS320C6472ECTZ7 is a high-performance fixed-point digital signal processor (DSP) developed by Texas Instruments. This device is part of the TMS320C6000™ DSP platform and is designed to meet the demands of high-end industrial, mission-critical, image and video processing, communication, media gateways, and remote access servers. The TMS320C6472 features six optimized TMS320C64x+™ megamodules, each providing high performance with low power dissipation. The device is available in three different speeds: 500 MHz, 625 MHz, and 700 MHz.

The TMS320C6472 is built on the third-generation VelociTI™ very-long-instruction-word (VLIW) architecture, which enhances its capability for complex signal processing tasks. It includes large on-chip memories, with 768K-Byte of shared RAM and 608K-Byte local L2 RAM per C64x+ megamodule, reducing the need for external memory and optimizing system power and cost.

Key Specifications

Characteristic Description
Processor Speed 500 MHz, 625 MHz, 700 MHz
Number of Megamodules Six TMS320C64x+ Megamodules
On-Chip Memory 768K-Byte shared RAM, 608K-Byte local L2 RAM per megamodule
Instruction Execution Eight 32-bit instructions per cycle
Multiply-Accumulate (MAC) Performance 4000 16-bit MMACs per second at 500 MHz
Endianess Little Endian, Big Endian
Ethernet MACs Two 10/100/1000 Mb/s Ethernet MACs (IEEE 802.3 Compliant)
DDR2 Memory Controller 32-bit DDR2 SDRAM interface (DDR2-533)
General-Purpose Timers Twelve 64-bit general-purpose timers
GPIO Pins Sixteen general-purpose input/output (GPIO) pins
Package Type 737-Pin Ball Grid Array (BGA) Package (CTZ/ZTZ)
Process Technology 0.09-μm/7-Level Cu Metal Process (CMOS)
Temperature Range 0°C to 85°C (commercial), -40°C to 100°C (extended for 500 MHz and 625 MHz devices)

Key Features

  • High-Performance DSP Core: Based on the third-generation VelociTI™ VLIW architecture, providing high performance with low power dissipation.
  • Large On-Chip Memory: 768K-Byte shared RAM and 608K-Byte local L2 RAM per C64x+ megamodule, reducing the need for external memory.
  • Multiple Functional Units: Each C64x+ megamodule core employs eight functional units, two register files, and two data paths.
  • High-Speed Interfaces: Two 10/100/1000 Mb/s Ethernet MACs, three Telecom Serial Interface Ports (TSIPs), and a 32-bit DDR2 SDRAM interface.
  • Peripheral Set: Includes UTOPIA Level 2 Slave ATM Controller, Serial RapidIO, I2C bus, and 16 general-purpose I/O (GPIO) pins.
  • Power Management: System PLL and PLL controllers, power-down logic, and dedicated PLL controllers for different peripherals.
  • Software Pipelining: Dedicated SPLOOP instruction for efficient software pipelining loops.
  • Compact Instructions: Support for 16-bit compact instructions to reduce code size.

Applications

  • High-End Industrial Applications: Suitable for industrial automation and control systems requiring high-performance processing.
  • Image and Video Processing: Ideal for high-end image and video processing tasks due to its large on-chip memory and high-performance DSP core.
  • Communication Systems: Used in media gateways, remote access servers, and other communication infrastructure.
  • Telecom Infrastructure: Supports video and telecom infrastructure applications with its high-speed interfaces and processing capabilities.
  • Imaging/Medical Applications: Suitable for medical imaging and other high-performance imaging applications.
  • Wireless Infrastructure: Used in wireless infrastructure applications requiring high-performance signal processing.

Q & A

  1. What is the TMS320C6472ECTZ7?

    The TMS320C6472ECTZ7 is a high-performance fixed-point digital signal processor (DSP) developed by Texas Instruments.

  2. What are the available speeds for the TMS320C6472?

    The device is available in three different speeds: 500 MHz, 625 MHz, and 700 MHz.

  3. How much on-chip memory does the TMS320C6472 have?

    The device has 768K-Byte of shared RAM and 608K-Byte local L2 RAM per C64x+ megamodule.

  4. What type of architecture does the TMS320C6472 use?

    The TMS320C6472 is based on the third-generation VelociTI™ very-long-instruction-word (VLIW) architecture.

  5. What are the key interfaces supported by the TMS320C6472?

    The device supports two 10/100/1000 Mb/s Ethernet MACs, three Telecom Serial Interface Ports (TSIPs), and a 32-bit DDR2 SDRAM interface.

  6. Does the TMS320C6472 support compact instructions?

    Yes, the TMS320C6472 supports 16-bit compact instructions to reduce code size.

  7. What is the purpose of the SPLOOP instruction in the TMS320C6472?

    The SPLOOP instruction aids in the creation of software pipelining loops, reducing code size and making loops fully interruptible.

  8. How many general-purpose timers does the TMS320C6472 have?

    The device has twelve 64-bit general-purpose timers.

  9. What is the package type of the TMS320C6472?

    The device is packaged in a 737-Pin Ball Grid Array (BGA) Package (CTZ/ZTZ).

  10. What is the temperature range for the TMS320C6472?

    The device operates within a temperature range of 0°C to 85°C (commercial) or -40°C to 100°C (extended for 500 MHz and 625 MHz devices).

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA
Clock Rate:700MHz
Non-Volatile Memory:ROM (768kB)
On-Chip RAM:1.44MB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:737-BFBGA, FCBGA
Supplier Device Package:737-FCBGA (24x24)
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Similar Products

Part Number TMS320C6472ECTZ7 TMS320C6472EZTZ7 TMS320C6472ECTZ
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Active Obsolete Active
Type Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA
Clock Rate 700MHz 700MHz 500MHz
Non-Volatile Memory ROM (768kB) ROM (768kB) ROM (768kB)
On-Chip RAM 1.44MB 1.44MB 1.44MB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.10V 1.20V 1.00V
Operating Temperature 0°C ~ 85°C (TC) 0°C ~ 85°C (TC) 0°C ~ 85°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 737-BFBGA, FCBGA 737-BFBGA, FCBGA 737-BFBGA, FCBGA
Supplier Device Package 737-FCBGA (24x24) 737-FCBGA (24x24) 737-FCBGA (24x24)

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