TMS320C6424ZDUL
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Texas Instruments TMS320C6424ZDUL

Manufacturer No:
TMS320C6424ZDUL
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP FIXED-POINT 376-BGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C6424ZDUL is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 DSP platform. This device is based on the C64x+ core, which features the advanced VelociTI.2 very-long-instruction-word (VLIW) architecture. The TMS320C6424 is designed to provide exceptional processing power and flexibility, making it an excellent choice for a wide range of digital signal processing applications.

Key Specifications

Parameter Specification
Processor Core C64x+ DSP Core
Clock Rate Up to 700 MHz
On-Chip Memory 256K-bit L1P Program Memory, 640K-bit L1D Data Memory, 1M-bit L2 Unified Memory
External Memory Interface 32-bit DDR2 SDRAM Memory Controller, Asynchronous EMIF (EMIFA)
Package Type 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
Voltage - I/O 1.8V, 3.3V
Voltage - Core 1.05V, 1.20V
Operating Temperature 0°C to 90°C (TJ)
Interfaces EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Non-Volatile Memory 64 kB ROM
Lead Free Status / RoHS Status Lead free / RoHS Compliant

Key Features

  • High-performance C64x+ DSP core with up to 5600 MIPS and 3200, 4000, 4800, or 5600 MMACS.
  • Flexible on-chip memory architecture including Level 1 and Level 2 caches.
  • Support for both little-endian and big-endian byte orders.
  • Integrated peripherals such as UARTs, PWMs, McBSP, McASP, and a 10/100 Mb/s Ethernet MAC.
  • External memory interfaces including DDR2 SDRAM and asynchronous EMIF.
  • Low-power design with various power management features.
  • Support for multiple media independent interfaces (MII, RMII) and management data input/output (MDIO) module.
  • VelociTI.2 extensions to the VelociTI VLIW architecture for enhanced performance.

Applications

The TMS320C6424ZDUL is versatile and can be used in a variety of embedded system applications, including:

  • Telecommunications: For signal processing in communication systems.
  • Industrial: For control and monitoring in industrial automation.
  • Medical: For medical imaging and diagnostic equipment.
  • Audio: For high-quality audio processing and compression.
  • Automotive: For in-vehicle systems requiring advanced signal processing.

Q & A

  1. What is the clock rate of the TMS320C6424ZDUL?

    The clock rate of the TMS320C6424ZDUL can be up to 700 MHz.

  2. What type of memory does the TMS320C6424ZDUL have?

    The device features 256K-bit L1P program memory, 640K-bit L1D data memory, and 1M-bit L2 unified memory.

  3. What are the supported interfaces on the TMS320C6424ZDUL?

    The device supports EBI/EMI, HPI, I²C, McASP, McBSP, UART, and 10/100 Ethernet MAC interfaces.

  4. What is the operating temperature range of the TMS320C6424ZDUL?

    The operating temperature range is from 0°C to 90°C (TJ).

  5. Is the TMS320C6424ZDUL RoHS compliant?
  6. What is the package type of the TMS320C6424ZDUL?

    The device is packaged in a 376-pin plastic BGA package (ZDU suffix) with a 1.0-mm ball pitch.

  7. What are the voltage requirements for the TMS320C6424ZDUL?

    The device requires 1.8V and 3.3V for I/O and 1.05V or 1.20V for the core.

  8. Does the TMS320C6424ZDUL support DDR2 SDRAM?
  9. What are some of the application areas for the TMS320C6424ZDUL?

    The device is used in telecommunications, industrial, medical, audio, and automotive applications.

  10. What is the significance of the VelociTI.2 architecture in the TMS320C6424ZDUL?

    The VelociTI.2 architecture provides enhanced performance through advanced VLIW instructions.

Product Attributes

Type:Fixed Point
Interface:EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate:400MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:240kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.05V, 1.20V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:376-BBGA Exposed Pad
Supplier Device Package:376-BGA (23x23)
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Similar Products

Part Number TMS320C6424ZDUL TMS320C6421ZDUL TMS320C6424ZDU4 TMS320C6424ZDU5 TMS320C6424ZDU6 TMS320C6424ZDU7
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Active Active Active Active
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate 400MHz 400MHz 400MHz 500MHz 600MHz 700MHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 240kB 96kB 240kB 240kB 240kB 240kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23)

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