TMS320C6424ZDU7
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Texas Instruments TMS320C6424ZDU7

Manufacturer No:
TMS320C6424ZDU7
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP FIXED-POINT 376-BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The TMS320C6424ZDU7 is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C64x+ DSP family. This device is based on the third-generation C64x+ very-long-instruction-word (VLIW) architecture, making it an excellent choice for demanding digital signal processing applications. The C6424 is upward code-compatible with previous devices in the C6000 DSP platform and offers enhanced functionality and an expanded instruction set.

The C6424 features a robust set of peripherals and memory configurations, including Level 1 and Level 2 memory architectures, external memory interfaces, and various communication interfaces. It is designed to support a wide range of applications, including telecom, audio, and industrial sectors.

Key Specifications

Feature Specification
CPU Core C64x+ DSP Core with VelociTI.2 Extensions
Instruction Cycle Time 2.5-, 2-, 1.67-, 1.43-ns
Clock Rate 400-, 500-, 600-, 700-MHz
Level 1 Program Memory (L1P) 256K-Bit (32K-Byte)
Level 1 Data Memory (L1D) 640K-Bit (80K-Byte)
Level 2 Unified Memory (L2) 1M-Bit (128K-Byte)
MIPS Performance 3200, 4000, 4800, 5600 MIPS
External Memory Interfaces DDR2 SDRAM, Asynchronous EMIF (EMIFA), NOR/NAND Flash
Package Type 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
Core Voltage 1.2 V, 1.05 V (for low-power devices)
I/O Voltage 1.8 V, 3.3 V
Process Technology 0.09-μm/6-Level Cu Metal Process (CMOS)

Key Features

  • High-performance C64x+ DSP Core with VelociTI.2 Extensions
  • Eight highly independent functional units with six ALUs and two multipliers
  • Flexible memory architecture with Level 1 and Level 2 memory configurations
  • External memory interfaces including DDR2 SDRAM and asynchronous EMIF
  • 10/100 Mb/s Ethernet MAC (EMAC) with MDIO module
  • I2C, VLYNQ, and multichannel buffered serial ports (McBSPs)
  • Two 64-bit general-purpose timers and one 64-bit watchdog timer
  • Two UARTs with hardware handshaking support
  • Three pulse width modulator (PWM) outputs
  • Individual power-saving modes and low-power device options
  • Support for both little and big endian byte order
  • Protected mode operation and exceptions support for error detection

Applications

  • Telecom: Supports various telecom interfaces and protocols.
  • Audio: Suitable for audio processing with interfaces like AC97 and I2S.
  • Industrial Applications: Used in industrial control systems and automation.
  • Other Applications: Also applicable in areas such as medical devices, automotive systems, and more.

Q & A

  1. What is the core architecture of the TMS320C6424?

    The TMS320C6424 is based on the C64x+ very-long-instruction-word (VLIW) architecture.

  2. What are the clock rates supported by the TMS320C6424?

    The device supports clock rates of 400-, 500-, 600-, and 700-MHz.

  3. What types of memory does the TMS320C6424 have?

    The device features Level 1 program memory (L1P), Level 1 data memory (L1D), and Level 2 unified memory (L2).

  4. Does the TMS320C6424 support external memory interfaces?

    Yes, it supports DDR2 SDRAM, asynchronous EMIF (EMIFA), and NOR/NAND Flash memory interfaces.

  5. What communication interfaces are available on the TMS320C6424?

    The device includes interfaces such as Ethernet MAC (EMAC), I2C, VLYNQ, McBSPs, and UARTs.

  6. What are the power-saving features of the TMS320C6424?

    The device has individual power-saving modes and low-power device options.

  7. What is the package type of the TMS320C6424ZDU7?

    The TMS320C6424ZDU7 comes in a 376-Pin Plastic BGA Package (ZDU Suffix) with a 1.0-mm ball pitch.

  8. What are the core and I/O voltages for the TMS320C6424?

    The core voltage is 1.2 V or 1.05 V for low-power devices, and the I/O voltage is 1.8 V or 3.3 V.

  9. Does the TMS320C6424 support both little and big endian byte order?

    Yes, it supports both little and big endian byte order.

  10. What development tools are available for the TMS320C6424?

    The device has a complete set of development tools including C compilers, DSP assembly optimizer, and a Windows debugger interface.

  11. What is the process technology used in the TMS320C6424?

    The device is manufactured using 0.09-μm/6-Level Cu Metal Process (CMOS) technology.

Product Attributes

Type:Fixed Point
Interface:EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate:700MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:240kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.05V, 1.20V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:376-BBGA Exposed Pad
Supplier Device Package:376-BGA (23x23)
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Similar Products

Part Number TMS320C6424ZDU7 TMS320C6424ZDUL TMS320C6421ZDU7 TMS320C6424ZDU4 TMS320C6424ZDU5 TMS320C6424ZDU6
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Obsolete Active Active Active Active
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate 700MHz 400MHz 700MHz 400MHz 500MHz 600MHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 240kB 240kB 96kB 240kB 240kB 240kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23)

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