TMS320C6424ZDU6
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Texas Instruments TMS320C6424ZDU6

Manufacturer No:
TMS320C6424ZDU6
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC FIXED-POINT DSP 376-BGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The TMS320C6424ZDU6 is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 DSP platform. It is based on the third-generation advanced VelociTI very-long-instruction-word (VLIW) architecture, making it an excellent choice for various digital signal processing applications. The C6424 device is upward code-compatible with previous C6000 DSP devices and offers enhanced functionality and an expanded instruction set. It operates at clock rates of up to 600 MHz, achieving performance levels of up to 4800 million instructions per second (MIPS).

Key Specifications

Specification Details
Clock Rate 400 MHz, 500 MHz, 600 MHz
Instruction Cycle Time 2.5 ns, 2 ns, 1.67 ns, 1.43 ns
MIPS Performance 3200, 4000, 4800, 5600 MIPS
Functional Units Eight highly independent functional units: six ALUs, two multipliers
Memory Architecture 256K-bit L1P program memory, 640K-bit L1D data memory, 1M-bit L2 unified memory
External Memory Interfaces 32-bit DDR2 SDRAM, asynchronous 16-bit EMIFA, NOR and NAND flash interfaces
Peripherals 10/100 Mb/s Ethernet MAC, 64-bit general-purpose timers, UARTs, I2C, McBSPs, SPI, PWM
Package 376-pin plastic BGA package (ZDU suffix)
Voltage 1.2 V core, 1.8 V and 3.3 V I/O

Key Features

  • High-Performance DSP Core: Based on the VelociTI.2 extensions to the VelociTI VLIW architecture, offering up to 4800 MIPS performance.
  • Advanced Memory Architecture: Includes Level 1 and Level 2 caches, with flexible allocation of memory and cache spaces.
  • External Memory Interfaces: Supports 32-bit DDR2 SDRAM, asynchronous EMIFA, and NOR and NAND flash memory interfaces.
  • Rich Peripheral Set: Includes 10/100 Mb/s Ethernet MAC, UARTs, I2C, McBSPs, SPI, PWM, and general-purpose timers.
  • Low Power and Power-Saving Modes: Features individual power-saving modes to optimize power consumption.
  • Development Tools: Comprehensive set of development tools including C compilers, DSP assembly optimizer, and Windows debugger interface.

Applications

  • Telecom: Suitable for high-performance telecom applications due to its advanced DSP capabilities and peripherals like Ethernet MAC.
  • Audio: Ideal for audio processing with support for multichannel audio serial ports and AC97 audio codec interface.
  • Industrial Applications: Used in various industrial applications requiring high-performance DSP and robust peripheral support.

Q & A

  1. What is the maximum clock rate of the TMS320C6424ZDU6?

    The maximum clock rate is 600 MHz.

  2. What is the MIPS performance of the TMS320C6424ZDU6 at 600 MHz?

    The MIPS performance at 600 MHz is up to 4800 MIPS.

  3. What types of external memory interfaces does the TMS320C6424ZDU6 support?

    It supports 32-bit DDR2 SDRAM, asynchronous EMIFA, and NOR and NAND flash memory interfaces.

  4. Does the TMS320C6424ZDU6 have Ethernet capabilities?

    Yes, it includes a 10/100 Mb/s Ethernet MAC with MDIO module.

  5. What is the package type and pin count of the TMS320C6424ZDU6?

    The package type is a 376-pin plastic BGA package (ZDU suffix).

  6. Is the TMS320C6424ZDU6 compatible with previous C6000 DSP devices?

    Yes, it is fully software-compatible with previous C6000 DSP devices.

  7. What are the voltage levels supported by the TMS320C6424ZDU6?

    The device supports 1.2 V core voltage and 1.8 V and 3.3 V I/O voltages.

  8. Does the TMS320C6424ZDU6 have power-saving modes?

    Yes, it features individual power-saving modes to optimize power consumption.

  9. What development tools are available for the TMS320C6424ZDU6?

    A comprehensive set of development tools including C compilers, DSP assembly optimizer, and Windows debugger interface are available.

  10. What are some common applications of the TMS320C6424ZDU6?

    Common applications include telecom, audio, and industrial applications due to its high-performance DSP capabilities and robust peripheral set.

Product Attributes

Type:Fixed Point
Interface:EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate:600MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:240kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.05V, 1.20V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:376-BBGA Exposed Pad
Supplier Device Package:376-BGA (23x23)
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Similar Products

Part Number TMS320C6424ZDU6 TMS320C6424ZDU7 TMS320C6424ZDUQ6 TMS320C6424ZDUL TMS320C6421ZDU6 TMS320C6424ZDU4 TMS320C6424ZDU5
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Obsolete Obsolete Active Active
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC EBI/EMI, HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate 600MHz 700MHz 600MHz 400MHz 600MHz 400MHz 500MHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 240kB 240kB 240kB 240kB 96kB 240kB 240kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V 1.05V, 1.20V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad 376-BBGA Exposed Pad
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23) 376-BGA (23x23)

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