TMS320C6202BGNZ300
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Texas Instruments TMS320C6202BGNZ300

Manufacturer No:
TMS320C6202BGNZ300
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DSP FIXED-POINT 352-FCBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The TMS320C6202BGNZ300 is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C62x generation within the TMS320C6000 DSP platform. This device is based on the advanced VelociTI very-long-instruction-word (VLIW) architecture, making it an excellent choice for multichannel and multifunction applications. The C6202B offers a performance capability of up to 2400 million instructions per second (MIPS) at 300 MHz, combining the operational flexibility of high-speed controllers with the numerical capability of array processors.

Key Specifications

Parameter Value
Performance Capability Up to 2400 MIPS at 300 MHz
Instruction Cycle Time 5-, 4-, 3.33-ns
Clock Rate 200-, 250-, 300-MHz
Functional Units Eight highly independent functional units:
  • Six ALUs (32-/40-Bit)
  • Two 16-Bit Multipliers (32-Bit Result)
General-Purpose Registers 32 32-Bit General-Purpose Registers
On-Chip Memory
  • 3M-Bit On-Chip SRAM
  • 2M-Bit Internal Program/Cache (64K 32-Bit Instructions)
  • 1M-Bit Dual-Access Internal Data (128K Bytes)
External Memory Interface 32-Bit External Memory Interface (EMIF), glueless interface to SDRAM or SBSRAM and asynchronous peripherals
Peripheral Set
  • Three Multichannel Buffered Serial Ports (McBSPs)
  • Two 32-Bit General-Purpose Timers
  • 32-Bit Expansion Bus (XBus)
Package 352-Pin BGA Package (GNZ)
Process Technology 0.15-µm/5-Level Metal Process
Voltage 3.3-V I/Os, 1.5-V Internal

Key Features

  • High-Performance DSP: Up to 2400 MIPS at 300 MHz, with eight highly independent functional units including six ALUs and two 16-bit multipliers.
  • Advanced Architecture: Based on the VelociTI VLIW architecture, providing high parallelism and efficiency.
  • On-Chip Memory: 3M-Bit on-chip SRAM, 2M-Bit internal program/cache, and 1M-Bit dual-access internal data.
  • Peripheral Set: Includes three McBSPs, two general-purpose timers, and a 32-bit expansion bus (XBus).
  • Glueless Interfaces: Supports glueless interfaces to SDRAM, SBSRAM, SRAM, EPROM, and other peripherals.
  • Development Tools: Comprehensive set of development tools including a new C compiler, assembly optimizer, and Windows debugger interface.

Applications

  • Multichannel and Multifunction Systems: Ideal for applications requiring high performance and multiple functionalities such as telecommunications, audio processing, and medical imaging.
  • High-Speed Controllers: Suitable for applications that require the operational flexibility of high-speed controllers.
  • Array Processing: Effective for tasks that demand the numerical capability of array processors.
  • Telecommunications: Can be used in T1/E1, MVIP, SCSA framers, and other telecommunication systems.
  • Audio and Video Processing: Applicable in audio and video processing due to its high performance and parallel processing capabilities.

Q & A

  1. What is the performance capability of the TMS320C6202B?

    The TMS320C6202B has a performance capability of up to 2400 million instructions per second (MIPS) at 300 MHz.

  2. What is the architecture of the TMS320C6202B based on?

    The TMS320C6202B is based on the advanced VelociTI very-long-instruction-word (VLIW) architecture.

  3. How many functional units does the TMS320C6202B have?

    The TMS320C6202B has eight highly independent functional units, including six ALUs and two 16-bit multipliers.

  4. What is the on-chip memory configuration of the TMS320C6202B?

    The TMS320C6202B has 3M-Bit on-chip SRAM, 2M-Bit internal program/cache, and 1M-Bit dual-access internal data.

  5. What peripherals are included in the TMS320C6202B?

    The peripheral set includes three McBSPs, two general-purpose timers, and a 32-bit expansion bus (XBus).

  6. Does the TMS320C6202B support glueless interfaces?

    Yes, it supports glueless interfaces to SDRAM, SBSRAM, SRAM, EPROM, and other peripherals.

  7. What development tools are available for the TMS320C6202B?

    A comprehensive set of development tools including a new C compiler, assembly optimizer, and Windows debugger interface.

  8. What are the typical applications of the TMS320C6202B?

    Typical applications include multichannel and multifunction systems, high-speed controllers, array processing, telecommunications, and audio/video processing.

  9. What is the package type of the TMS320C6202BGNZ300?

    The TMS320C6202BGNZ300 comes in a 352-Pin BGA Package (GNZ).

  10. What is the process technology used in the TMS320C6202B?

    The TMS320C6202B is manufactured using a 0.15-µm/5-Level Metal Process.

Product Attributes

Type:Fixed Point
Interface:McBSP
Clock Rate:300MHz
Non-Volatile Memory:External
On-Chip RAM:384KB
Voltage - I/O:3.30V
Voltage - Core:1.50V
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:352-BBGA, FCBGA
Supplier Device Package:352-FCBGA (27x27)
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Similar Products

Part Number TMS320C6202BGNZ300 TMS320C6202BZNZ300 TMS320C6203BGNZ300 TMS320C6202BGNY300
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Not For New Designs Not For New Designs Not For New Designs
Type Fixed Point Fixed Point Fixed Point Fixed Point
Interface McBSP McBSP McBSP McBSP
Clock Rate 300MHz 300MHz 300MHz 300MHz
Non-Volatile Memory External External External External
On-Chip RAM 384KB 384KB 896kB 384KB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.50V 1.50V 1.50V 1.50V
Operating Temperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 352-BBGA, FCBGA 352-BBGA, FCBGA 352-BBGA, FCBGA 384-FBGA, FCCSPBGA
Supplier Device Package 352-FCBGA (27x27) 352-FCBGA (27x27) 352-FCBGA (27x27) 384-FC/CSP (18x18)

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