STM32MP151CAB3T
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STMicroelectronics STM32MP151CAB3T

Manufacturer No:
STM32MP151CAB3T
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
MPU WITH ARM CORTEX-A7 650 MHZ,
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP151CAB3T, produced by STMicroelectronics, is a high-performance microprocessor unit (MPU) that combines the Arm® Cortex®-A7 and Arm® Cortex®-M4 cores. This device is designed to offer rich performance and energy efficiency, making it suitable for high-end wearables, consumer electronics, and other low-power embedded applications. The Cortex-A7 core operates at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz, providing a robust architecture for demanding tasks. The STM32MP151CAB3T also features extensive memory options, advanced communication interfaces, and a range of peripherals, enhancing its versatility and functionality.

Key Specifications

Parameter Specification
Core Processor Arm® Cortex®-A7 (up to 800 MHz) + Arm® Cortex®-M4 (up to 209 MHz)
L1 Cache 32-Kbyte instruction cache, 32-Kbyte data cache
L2 Cache 256-Kbyte unified level 2 cache
Internal SRAM 708 Kbytes: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain + 4 Kbytes of SRAM in Backup domain
External Memory Up to 1 Gbyte DDR3/DDR3L, LPDDR2/LPDDR3
Supply Voltage 1.71 V to 3.6 V
Operating Temperature -40°C to 125°C
Package LFBGA-354
Communication Interfaces USB 2.0, Ethernet (10/100M or Gigabit), I2C, SPI, UART, USART, SAI, HDMI-CEC
Security Features Secure boot, TrustZone®, cryptographic acceleration cell

Key Features

  • High-Performance Cores: Arm® Cortex®-A7 and Arm® Cortex®-M4 cores for balanced performance and power efficiency.
  • Advanced Memory Options: External DDR memory up to 1 Gbyte and extensive internal SRAM.
  • Extensive Peripherals: Includes ADCs, DACs, timers, PWM timers, low-power timers, RNG, and cryptographic acceleration cell.
  • Communication Interfaces: Supports multiple communication protocols such as USB 2.0, Ethernet, I2C, SPI, UART, USART, and SAI.
  • Security Features: Secure boot, TrustZone®, and cryptographic acceleration for enhanced security.
  • Low Power Consumption: Designed for low-power applications with efficient power management.
  • Advanced Analog Capabilities: Includes digital filters for external sigma delta modulators and other advanced analog peripherals.

Applications

The STM32MP151CAB3T is well-suited for a variety of applications, including:

  • High-End Wearables: Offers the performance and power efficiency required for advanced wearable devices.
  • Consumer Electronics: Ideal for consumer electronics that demand rich functionality and reliable operation.
  • Embedded Systems: Suitable for low-power embedded systems that require high performance and advanced features.
  • Industrial Automation: Can be used in industrial automation due to its robust architecture and extensive peripherals.
  • IoT Devices: Appropriate for IoT devices that need advanced communication interfaces and security features.

Q & A

  1. What are the core processors used in the STM32MP151CAB3T?

    The STM32MP151CAB3T uses the Arm® Cortex®-A7 and Arm® Cortex®-M4 cores.

  2. What is the maximum operating frequency of the Cortex-A7 core?

    The Cortex-A7 core operates at up to 800 MHz.

  3. What is the maximum operating frequency of the Cortex-M4 core?

    The Cortex-M4 core operates at up to 209 MHz.

  4. What types of external memory does the STM32MP151CAB3T support?

    The device supports up to 1 Gbyte of DDR3/DDR3L and LPDDR2/LPDDR3 external memory.

  5. What is the operating temperature range of the STM32MP151CAB3T?

    The operating temperature range is -40°C to 125°C.

  6. What security features are included in the STM32MP151CAB3T?

    The device includes secure boot, TrustZone®, and a cryptographic acceleration cell.

  7. What communication interfaces are available on the STM32MP151CAB3T?

    The device supports USB 2.0, Ethernet (10/100M or Gigabit), I2C, SPI, UART, USART, SAI, and HDMI-CEC.

  8. What types of analog peripherals are available on the STM32MP151CAB3T?

    The device includes ADCs, DACs, and digital filters for external sigma delta modulators.

  9. Is the STM32MP151CAB3T suitable for industrial applications?

    Yes, it is suitable due to its robust architecture and extensive peripherals.

  10. What is the package type of the STM32MP151CAB3T?

    The package type is LFBGA-354.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:209MHz, 650MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps (1)
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-40°C ~ 125°C (TA)
Security Features:ARM TZ
Package / Case:354-LFBGA
Supplier Device Package:354-LFBGA (16x16)
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Similar Products

Part Number STM32MP151CAB3T STM32MP151CAD3T STM32MP151CAC3T STM32MP153CAB3T STM32MP157CAB3T STM32MP151AAB3T STM32MP151CAA3T STM32MP151CAB3
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps (1)
SATA - - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 354-LFBGA 257-TFBGA 361-TFBGA 354-LFBGA 354-LFBGA 354-LFBGA 448-LFBGA 354-LFBGA
Supplier Device Package 354-LFBGA (16x16) 257-TFBGA (10x10) 361-TFBGA (12x12) 354-LFBGA (16x16) 354-LFBGA (16x16) 354-LFBGA (16x16) 448-LFBGA (18x18) 354-LFBGA (16x16)

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