SPC584C80E3G0C0X
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STMicroelectronics SPC584C80E3G0C0X

Manufacturer No:
SPC584C80E3G0C0X
Manufacturer:
STMicroelectronics
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 4MB FLASH 100ETQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC584C80E3G0C0X is a 32-bit microcontroller from STMicroelectronics, part of the SPC58 C Line family. This device is designed for automotive applications and builds on the legacy of the SPC564Cx and SPC56ECx families, offering significant improvements in power and performance. It features dual e200z420n3 cores, each operating at up to 180 MHz, and is compliant with the Power Architecture embedded specification. The microcontroller is AEC-Q100 qualified and supports ASIL-B safety standards according to ISO 26262, making it suitable for high-reliability automotive systems.

Key Specifications

Feature Description
Number of Cores 2 (e200z420) + 1 (e200z0 in HSM)
Core Frequency Up to 180 MHz
Flash Memory 4096 KB code flash + 128 KB data flash
HSM Dedicated Flash 176 KB (144 KB code + 32 KB data)
SRAM 384 KB on-chip general-purpose SRAM + 128 KB core local data RAM
DMA Channels 64 eDMA channels
Interrupt Controller 1 INTC with 568 sources
Analog-to-Digital Converters 3 independent fast 12-bit SAR, 1 supervisor 12-bit SAR, 1 10-bit SAR with STDBY mode
Communication Interfaces 18 LINFlexD, 8 DSPI, 8 MCAN (ISO CAN-FD), Dual-channel FlexRay, 1 Ethernet 10/100 Mbps
Package Options eTQFP100, eTQFP64, eTQFP144, FPBGA292, eLQFP176
Junction Temperature Range -40 °C to 150 °C

Key Features

  • AEC-Q100 qualified for automotive reliability
  • High-performance e200z420n3 dual-core CPU with Variable Length Encoding (VLE)
  • Single-precision floating-point operations and SIMD support
  • Comprehensive ASIL-B safety concept with FCCU, MEMU, and CRC unit
  • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM with end-to-end ECC
  • Enhanced modular IO subsystem (eMIOS) with up to 64 timed I/O channels
  • Body cross triggering unit (BCTU) for ADC conversions
  • Low power capabilities including versatile low power modes and ultra-low power standby with RTC
  • Dual phase-locked loops and integrated linear voltage regulator
  • Nexus development interface (NDI) and JTAG support
  • Boot assist Flash (BAF) for factory programming through asynchronous CAN or LIN/UART

Applications

The SPC584C80E3G0C0X microcontroller is primarily designed for automotive applications, including but not limited to:

  • Advanced driver-assistance systems (ADAS)
  • Engine control units (ECUs)
  • Transmission control units (TCUs)
  • Body control modules (BCMs)
  • Safety-critical systems requiring ASIL-B compliance

Q & A

  1. What is the core architecture of the SPC584C80E3G0C0X?

    The device features two e200z420n3 cores and one e200z0 core embedded in the Hardware Security Module (HSM).

  2. What is the maximum operating frequency of the cores?

    The cores can operate at up to 180 MHz.

  3. How much flash and SRAM memory does the device have?

    The device has 4096 KB code flash + 128 KB data flash and 384 KB on-chip general-purpose SRAM plus 128 KB core local data RAM.

  4. What safety standards does the device comply with?

    The device complies with ASIL-B safety standards according to ISO 26262.

  5. What communication interfaces are available on the device?

    The device includes 18 LINFlexD, 8 DSPI, 8 MCAN (ISO CAN-FD), dual-channel FlexRay, and one Ethernet 10/100 Mbps interface.

  6. What are the low power capabilities of the device?

    The device features versatile low power modes, ultra-low power standby with RTC, and a Smart Wake-up Unit for contact monitoring.

  7. What is the junction temperature range of the device?

    The junction temperature range is -40 °C to 150 °C.

  8. What package options are available for the SPC584C80E3G0C0X?

    The device is available in eTQFP100, eTQFP64, eTQFP144, FPBGA292, and eLQFP176 packages.

  9. Does the device support any specific development interfaces?

    Yes, it supports the Nexus development interface (NDI) and JTAG.

  10. How can the device be programmed at the factory?

    The device supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART via Boot Assist Flash (BAF).

Product Attributes

Core Processor:e200z420
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, I²C, LINbus, SPI
Peripherals:DMA
Number of I/O:80
Program Memory Size:4MB (4M x 8)
Program Memory Type:Flash
EEPROM Size:128K x 8
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3.3V, 5V
Data Converters:- 
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TQFP Exposed Pad
Supplier Device Package:100-eTQFP (14x14)
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