LSM330DLC
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STMicroelectronics LSM330DLC

Manufacturer No:
LSM330DLC
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
IMU ACCEL/MAG I2C/SPI 28LGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LSM330DLC is a system-in-package (SiP) inertial measurement unit (IMU) developed by STMicroelectronics. This module integrates a 3D digital accelerometer and a 3D digital gyroscope, providing comprehensive motion sensing capabilities. It is part of ST's iNEMO family of MEMS sensor modules, known for their robust performance and reliability.

Key Specifications

ParameterValue
ManufacturerSTMicroelectronics
PackagingTray
Output TypeDigital
Sensing AxisX, Y, Z
SeriesLSM330
Factory Pack Quantity2940
InterfaceI2C/SPI
Package Type28LGA

Key Features

  • 3-axis digital accelerometer and 3-axis digital gyroscope
  • Digital output via I2C or SPI interfaces
  • Triple channel configuration for comprehensive motion sensing
  • Robust performance and reliability as part of ST's iNEMO family
  • Compact 28LGA package

Applications

The LSM330DLC is suitable for a variety of applications requiring precise motion sensing, including:

  • Consumer electronics such as smartphones, tablets, and gaming consoles
  • Industrial automation and robotics
  • Aerospace and defense systems
  • Health and fitness devices
  • Automotive systems, including navigation and stability control

Q & A

  1. What is the LSM330DLC? The LSM330DLC is a system-in-package inertial measurement unit (IMU) featuring a 3D digital accelerometer and a 3D digital gyroscope.
  2. Who is the manufacturer of the LSM330DLC? The LSM330DLC is manufactured by STMicroelectronics.
  3. What are the sensing axes of the LSM330DLC? The LSM330DLC senses motion along the X, Y, and Z axes.
  4. What are the output interfaces of the LSM330DLC? The LSM330DLC provides digital output via I2C or SPI interfaces.
  5. What is the package type of the LSM330DLC? The LSM330DLC is packaged in a 28LGA package.
  6. Is the LSM330DLC still in production? No, the LSM330DLC is no longer manufactured.
  7. What are some common applications of the LSM330DLC? Common applications include consumer electronics, industrial automation, aerospace, health and fitness devices, and automotive systems.
  8. What is the factory pack quantity of the LSM330DLC? The factory pack quantity is 2940 units per tray.
  9. What family of MEMS sensor modules does the LSM330DLC belong to? The LSM330DLC belongs to ST's iNEMO family of MEMS sensor modules.
  10. Why is the LSM330DLC considered robust? The LSM330DLC is considered robust due to its integration into ST's iNEMO family, known for reliable performance.

Product Attributes

Sensor Type:Accelerometer, Magnetometer, 6 Axis
Output Type:I²C, SPI
Operating Temperature:-40°C ~ 85°C (TA)
Package / Case:28-TFLGA Module
Supplier Device Package:28-LGA (4x5)
Mounting Type:Surface Mount
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