Overview
The TDA8034HN/C1,118, produced by NXP USA Inc., is a cost-effective analog interface designed for asynchronous and synchronous smart cards. This integrated circuit operates at various voltage levels, including 5 V, 3 V, and 1.8 V, making it versatile for different smart card applications. The TDA8034HN provides comprehensive supply, protection, and control functions between the smart card and the microcontroller, requiring minimal external components. It is packaged in a 24-pin HVQFN (4x4 mm) package, enhancing its suitability for compact and efficient system designs.
Key Specifications
Parameter | Description |
---|---|
Package Type | 24-pin HVQFN (4x4 mm) |
Smart Card Supply Voltage | 5 V, 3 V, or 1.8 V ± 5% |
Power Consumption (Deep Shutdown mode) | Very low power consumption |
I/O Lines | Three protected half-duplex bidirectional buffered I/O lines (C4, C7, and C8) |
VCC Regulation | Using two low ESR multilayer ceramic capacitors (220 nF and 470 nF) |
Current Spikes | Up to 40 nA/s (VCC = 5 V and 3 V) or 15 nA/s (VCC = 1.8 V) up to 20 MHz |
Protection Features | Thermal and short-circuit protection for all card contacts; Enhanced ESD protection (> 8 kV) |
External Clock Input | Up to 26 MHz connected to pin XTAL1 |
Card Clock Generation | Up to 20 MHz using pins CLKDIV1 and CLKDIV2 |
Compatibility | Compatible with ISO 7816, NDS, and EMVCo 4.3 payment systems |
Key Features
- Integrated circuit smart card interface with minimal external components required.
- Supports 5 V, 3 V, or 1.8 V smart card supply with ±5% regulation.
- Very low power consumption in Deep Shutdown mode.
- Three protected half-duplex bidirectional buffered I/O lines (C4, C7, and C8).
- Thermal and short-circuit protection for all card contacts.
- Enhanced card-side ElectroStatic Discharge (ESD) protection of > 8 kV.
- External clock input up to 26 MHz connected to pin XTAL1.
- Card clock generation up to 20 MHz using pins CLKDIV1 and CLKDIV2.
- Automatic activation and deactivation sequences triggered by various events (short-circuit, card take-off, overheating, falling VDD, VDD(INTF), or VDDP).
- Built-in debouncing on card presence contacts (typically 8 ms).
- Supply supervisor for killing spikes during power on and off.
Applications
The TDA8034HN/C1,118 is designed for use in various smart card applications, including:
- Payment systems compliant with ISO 7816, NDS, and EMVCo 4.3.
- Secure identification and authentication systems.
- Smart card readers and writers in POS terminals, ATMs, and other financial devices.
- Embedded systems requiring secure and efficient smart card interfaces.
Q & A
- What are the supported voltage levels for the TDA8034HN/C1,118?
The TDA8034HN/C1,118 supports 5 V, 3 V, and 1.8 V smart card supply voltages.
- What is the package type of the TDA8034HN/C1,118?
The TDA8034HN/C1,118 is packaged in a 24-pin HVQFN (4x4 mm) package.
- Does the TDA8034HN/C1,118 have built-in protection features?
Yes, it includes thermal and short-circuit protection for all card contacts and enhanced ESD protection of > 8 kV.
- How does the TDA8034HN/C1,118 handle card clock generation?
The TDA8034HN/C1,118 generates card clocks up to 20 MHz using pins CLKDIV1 and CLKDIV2.
- Is the TDA8034HN/C1,118 compatible with standard payment systems?
Yes, it is compatible with ISO 7816, NDS, and EMVCo 4.3 payment systems.
- What is the purpose of the debouncing feature in the TDA8034HN/C1,118?
The debouncing feature ensures stable card presence detection, operating typically for 8 ms.
- How does the TDA8034HN/C1,118 manage power spikes during power on and off?
The TDA8034HN/C1,118 includes a supply supervisor to kill spikes during power on and off using a fixed threshold or an external resistor bridge.
- Can the TDA8034HN/C1,118 be used in low-power applications?
Yes, it has very low power consumption in Deep Shutdown mode.
- What is the maximum frequency of the external clock input for the TDA8034HN/C1,118?
The external clock input can be up to 26 MHz connected to pin XTAL1.
- How does the TDA8034HN/C1,118 handle automatic activation and deactivation sequences?
The sequences are triggered by events such as short-circuit, card take-off, overheating, falling VDD, VDD(INTF), or VDDP.