SPC5606BK0MLQ6R
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NXP USA Inc. SPC5606BK0MLQ6R

Manufacturer No:
SPC5606BK0MLQ6R
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 1MB FLASH 144LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC5606BK0MLQ6R is a 32-bit microcontroller from the MPC560xB/C/D family, designed by NXP Semiconductors. This system-on-chip (SoC) microcontroller is tailored for automotive body electronics and industrial applications, offering advanced integration and cost-efficiency. It features the e200z0 host processor core, which complies with Power Architecture® technology and includes the Variable-Length Encoding (VLE) Auxiliary Processor Unit (APU).

Key Specifications

ParameterValue
Processor Coree200z0 with VLE APU
ArchitecturePower Architecture®
Package Type144 LQFP (20 mm x 20 mm)
Flash MemoryUp to 2 MB
SRAMUp to 128 KB
GPIOUp to 121 pins
Timers7 ch O(I)PWM / ICOC, 13 ch OPWM / ICOC
Communication InterfacesSCI (LINFlex), SPI (DSPI), CAN (FlexCAN), I2C
Debug InterfaceJTAG
Oscillator32 KHz oscillator

Key Features

  • Advanced e200z0 host processor core with VLE APU for efficient processing.
  • Integrated peripherals including PWM, Input Capture, Output Compare, SCI (LINFlex), SPI (DSPI), CAN (FlexCAN), and I2C.
  • High number of GPIO pins with multiplexing capabilities.
  • Support for 32 KHz oscillator and various clocking options.
  • JTAG debug interface for development and debugging.
  • Robust and scalable design suitable for automotive and industrial applications.

Applications

The SPC5606BK0MLQ6R microcontroller is designed for use in automotive body electronics and industrial control systems. It is particularly suited for applications requiring advanced integration, reliability, and cost-efficiency. Some specific use cases include:

  • Automotive body control modules.
  • Industrial automation and control systems.
  • Powertrain and chassis control systems.
  • Advanced driver-assistance systems (ADAS).

Q & A

  1. What is the processor core of the SPC5606BK0MLQ6R?
    The processor core is the e200z0 with Variable-Length Encoding (VLE) Auxiliary Processor Unit (APU).
  2. What is the package type of the SPC5606BK0MLQ6R?
    The package type is 144 LQFP (20 mm x 20 mm).
  3. How much flash memory does the SPC5606BK0MLQ6R have?
    The SPC5606BK0MLQ6R has up to 2 MB of flash memory.
  4. What communication interfaces are available on the SPC5606BK0MLQ6R?
    The microcontroller features SCI (LINFlex), SPI (DSPI), CAN (FlexCAN), and I2C interfaces.
  5. Does the SPC5606BK0MLQ6R support JTAG debugging?
    Yes, it supports JTAG debugging.
  6. What are some typical applications of the SPC5606BK0MLQ6R?
    Typical applications include automotive body electronics, industrial automation, powertrain and chassis control systems, and advanced driver-assistance systems (ADAS).
  7. How many GPIO pins does the SPC5606BK0MLQ6R have?
    The microcontroller has up to 121 GPIO pins.
  8. What is the oscillator frequency supported by the SPC5606BK0MLQ6R?
    The microcontroller supports a 32 KHz oscillator.
  9. Is the SPC5606BK0MLQ6R suitable for industrial applications?
    Yes, it is designed for both automotive and industrial applications.
  10. What is the architecture of the SPC5606BK0MLQ6R processor?
    The processor architecture is Power Architecture®.

Product Attributes

Core Processor:e200z0h
Core Size:32-Bit Single-Core
Speed:64MHz
Connectivity:CANbus, I²C, LINbus, SCI, SPI
Peripherals:DMA, POR, PWM, WDT
Number of I/O:121
Program Memory Size:1MB (1M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:80K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 15x10b, 5x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
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Similar Products

Part Number SPC5606BK0MLQ6R SPC5606BK0VLQ6R SPC5606BK0MLU6R SPC5605BK0MLQ6R SPC5606BK0MLL6R SPC5606BK0MLQ6
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor e200z0h e200z0h e200z0h e200z0h e200z0h e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 64MHz 64MHz 64MHz 64MHz 64MHz 64MHz
Connectivity CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 121 121 149 121 77 121
Program Memory Size 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8) 768KB (768K x 8) 1MB (1M x 8) 1MB (1M x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 80K x 8 80K x 8 80K x 8 64K x 8 80K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 15x10b, 5x12b A/D 15x10b, 5x12b A/D 29x10b, 5x12b A/D 15x10b, 5x12b A/D 7x10b, 5x12b A/D 15x10b, 5x12b
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 144-LQFP 144-LQFP 176-LQFP 144-LQFP 100-LQFP 144-LQFP
Supplier Device Package 144-LQFP (20x20) 144-LQFP (20x20) 176-LQFP (24x24) 144-LQFP (20x20) 100-LQFP (14x14) 144-LQFP (20x20)

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