MPC5125YVN400
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NXP USA Inc. MPC5125YVN400

Manufacturer No:
MPC5125YVN400
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT ROMLESS 324PBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MPC5125YVN400 is a 32-bit microcontroller produced by NXP USA Inc., leveraging the Power Architecture technology. This microcontroller is designed with a high-performance e300 CPU core, operating at speeds of up to 400 MHz. It is particularly suited for applications requiring robust communication and system integration capabilities. The device is packaged in a 324-pin TEPBGA (Thermal Enhanced Plastic Ball Grid Array) and supports a wide range of operating temperatures from -40°C to 125°C.

Key Specifications

Parameter Value
Architecture Power Architecture
No. of Bits 32-bit
CPU Speed 400 MHz
RAM Memory Size 32 KB (on-chip SRAM)
No. of Pins 324 Pins
MCU Case Style TEPBGA
No. of I/O's 64 I/O's
Embedded Interface Type CAN, I2C, SPI, UART, USB
Supply Voltage Range 1.33V to 1.47V, 3V to 3.6V
Operating Temperature Range -40°C to 125°C

Key Features

  • e300 Power Architecture processor core: Enhanced version of the MPC603e core, operating up to 400 MHz.
  • Low Power Design: Optimized for low power consumption.
  • Display Interface Unit (DIU): Supports various display interfaces.
  • Memory Controllers: Supports DDR1, DDR2, low-power mobile DDR (LPDDR), and 1.8 V/3.3 V SDR DRAM.
  • USB 2.0 OTG Controller: With ULPI interface.
  • DMA Subsystem: For efficient data transfer.
  • External Memory Bus (EMB) Interface: Flexible multi-function interface.
  • NAND Flash Controller (NFC): For NAND flash memory management.
  • LocalPlus Interface (LPC): For legacy system integration.
  • 10/100Base Ethernet: For network connectivity.
  • MMC/SD/SDIO Card Host Controller (SDHC): For memory card interfaces.
  • Programmable Serial Controller (PSC): For serial communication.
  • Inter-integrated Circuit (I2C) Communication Interfaces: For I2C communication.
  • Controller Area Network (CAN): For automotive and industrial applications.
  • J1850 Byte Data Link Controller (BDLC) Interface: For automotive communication.
  • On-chip Real-Time Clock (RTC): For timekeeping.
  • On-chip Temperature Sensor: For temperature monitoring.
  • IC Identification Module (IIM): For device identification.

Applications

  • Automotive Systems: Due to its support for CAN, J1850 BDLC, and other automotive-specific interfaces.
  • Industrial Control Systems: Leveraging its robust communication and system integration capabilities.
  • Embedded Systems: Suitable for applications requiring high performance and low power consumption.
  • Consumer Electronics: For devices needing advanced display and memory management.
  • Networked Devices: With its 10/100Base Ethernet and USB OTG capabilities.

Q & A

  1. What is the CPU architecture of the MPC5125YVN400?

    The MPC5125YVN400 uses the Power Architecture technology with an e300 CPU core.

  2. What is the maximum operating frequency of the MPC5125YVN400?

    The maximum operating frequency is 400 MHz.

  3. What type of memory does the MPC5125YVN400 support?

    The device supports DDR1, DDR2, low-power mobile DDR (LPDDR), and 1.8 V/3.3 V SDR DRAM.

  4. What are the key communication interfaces available on the MPC5125YVN400?

    The device includes CAN, I2C, SPI, UART, USB 2.0 OTG, and 10/100Base Ethernet interfaces.

  5. What is the operating temperature range of the MPC5125YVN400?

    The operating temperature range is from -40°C to 125°C.

  6. Is the MPC5125YVN400 RoHS compliant?

    The part has not been flagged as RoHS Compliant, but it is phthalates compliant.

  7. Where can I find additional datasheets and technical documents for the MPC5125YVN400?

    Additional datasheets, footprints, and schematics can be found on the part details page of authorized distributors or on the NXP website.

  8. What are some common applications of the MPC5125YVN400?

    Common applications include automotive systems, industrial control systems, embedded systems, consumer electronics, and networked devices.

  9. Who are the authorized distributors for the MPC5125YVN400?

    Authorized distributors include Chip One Stop, Newark Electronics, Avnet America, EBV Elektronik, and Avnet Silica.

  10. How can I check the stock and lead times for the MPC5125YVN400?

    Stock availability and lead times can be checked on the comparison pages of authorized distributors.

Product Attributes

Core Processor:e300
Core Size:32-Bit Single-Core
Speed:400MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals:DMA, WDT
Number of I/O:64
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:32K x 8
Voltage - Supply (Vcc/Vdd):1.08V ~ 3.6V
Data Converters:- 
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TJ)
Mounting Type:Surface Mount
Package / Case:324-BBGA
Supplier Device Package:324-PBGA (23x23)
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In Stock

$50.36
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Same Series
MPC5125YVN400R
MPC5125YVN400R
IC MCU 32BIT ROMLESS 324PBGA

Similar Products

Part Number MPC5125YVN400 MPC5125YVN400R
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Core Processor e300 e300
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 400MHz 400MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, USB OTG CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals DMA, WDT DMA, WDT
Number of I/O 64 64
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.08V ~ 3.6V 1.08V ~ 3.6V
Data Converters - -
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)
Mounting Type Surface Mount Surface Mount
Package / Case 324-BBGA 324-BBGA
Supplier Device Package 324-PBGA (23x23) 324-PBGA (23x23)

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