MCIMX537CVP8C2
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NXP USA Inc. MCIMX537CVP8C2

Manufacturer No:
MCIMX537CVP8C2
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MPU 32BIT ARM 529PBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MCIMX537CVP8C2 is a high-performance microprocessor from NXP USA Inc., part of the i.MX53 family. This device is optimized for both performance and power efficiency, making it suitable for high-end and advanced applications. It features an ARM Cortex-A8 core, which provides a robust processing capability with a clock speed of up to 800 MHz. This microprocessor is designed to meet the demands of various sophisticated applications, including those in the industrial, automotive, and consumer electronics sectors.

Key Specifications

ParameterValue
Processor CoreARM Cortex-A8
Core SpeedUp to 800 MHz
Number of Cores1
Bit Width32-bit
Package TypeFBGA529 (Fine-Pitch Ball Grid Array)
Package Size19x19 mm
Operating Temperature-40°C to 105°C (Industrial Grade)

Key Features

  • ARM Cortex-A8 Core: Provides high processing performance and efficiency.
  • High Clock Speed: Up to 800 MHz for demanding applications.
  • Integrated Peripherals: Includes various peripherals such as USB, SATA, and PCIe for comprehensive system integration.
  • Low Power Consumption: Optimized for power efficiency to support battery-powered and energy-sensitive applications.
  • Advanced Graphics and Video Capabilities: Supports 2D and 3D graphics acceleration and high-definition video playback.

Applications

  • Industrial Automation: Suitable for control systems, human-machine interfaces, and other industrial applications.
  • Automotive Systems: Used in infotainment systems, navigation, and other automotive electronics.
  • Consumer Electronics: Ideal for smart home devices, set-top boxes, and other consumer electronic products.
  • Medical Devices: Can be used in medical imaging, patient monitoring, and other medical equipment.

Q & A

  1. What is the core architecture of the MCIMX537CVP8C2?
    The MCIMX537CVP8C2 features an ARM Cortex-A8 core.
  2. What is the maximum clock speed of the MCIMX537CVP8C2?
    The maximum clock speed is up to 800 MHz.
  3. What is the package type of the MCIMX537CVP8C2?
    The package type is FBGA529 (Fine-Pitch Ball Grid Array).
  4. What are the operating temperature ranges for the MCIMX537CVP8C2?
    The operating temperature range is -40°C to 105°C (Industrial Grade).
  5. What kind of graphics and video capabilities does the MCIMX537CVP8C2 support?
    It supports 2D and 3D graphics acceleration and high-definition video playback.
  6. Is the MCIMX537CVP8C2 suitable for automotive applications?
    Yes, it is suitable for automotive systems such as infotainment and navigation.
  7. What are some of the integrated peripherals available on the MCIMX537CVP8C2?
    It includes peripherals such as USB, SATA, and PCIe.
  8. Is the MCIMX537CVP8C2 energy-efficient?
    Yes, it is optimized for low power consumption.
  9. Can the MCIMX537CVP8C2 be used in medical devices?
    Yes, it can be used in medical imaging, patient monitoring, and other medical equipment.
  10. Where can I find detailed documentation and software for the MCIMX537CVP8C2?
    Detailed documentation and software can be found on the NXP Semiconductors official website and other authorized distributors.

Product Attributes

Core Processor:ARM® Cortex®-A8
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:800MHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, DDR2, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD, LVDS
Ethernet:10/100Mbps (1)
SATA:SATA 1.5Gbps (1)
USB:USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage - I/O:1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:
Package / Case:529-FBGA
Supplier Device Package:529-FBGA (19x19)
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Similar Products

Part Number MCIMX537CVP8C2 MCIMX537CVV8C2
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Obsolete
Core Processor ARM® Cortex®-A8 ARM® Cortex®-A8
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 800MHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3 LPDDR2, DDR2, DDR3
Graphics Acceleration Yes Yes
Display & Interface Controllers Keypad, LCD, LVDS Keypad, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1)
SATA SATA 1.5Gbps (1) SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O 1.3V, 1.8V, 2.775V, 3.3V 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 85°C (TA)
Security Features
Package / Case 529-FBGA 529-FBGA
Supplier Device Package 529-FBGA (19x19) 529-FBGA (19x19)

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