MCF5372LCVM240
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NXP USA Inc. MCF5372LCVM240

Manufacturer No:
MCF5372LCVM240
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT ROMLESS 196MAPBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The MCF5372LCVM240 is a microprocessor from NXP Semiconductors, part of the MCF537x family. It is designed to provide a single-chip solution for flexible communication within industrial control systems. This microprocessor integrates various features to support complex system designs, making it a robust choice for industrial applications.

Key Specifications

SpecificationValue
Processor CoreVersion 3 ColdFire variable-length RISC processor core
Package TypeLQFP-240
Operating FrequencyUp to 200 MHz
System Debug SupportYes
JTAG SupportYes, for system level board testing
Temperature Range-40°C to 85°C

Key Features

  • Version 3 ColdFire variable-length RISC processor core
  • System debug support for enhanced debugging capabilities
  • JTAG support for system level board testing
  • Integrated peripherals and interfaces to support various industrial control functions

Applications

The MCF5372LCVM240 is primarily used in industrial control systems, including but not limited to:

  • Industrial automation
  • Control systems for machinery and equipment
  • Embedded systems requiring high performance and flexibility

Q & A

  1. What is the processor core of the MCF5372LCVM240?
    The processor core is the Version 3 ColdFire variable-length RISC processor core.
  2. What is the maximum operating frequency of the MCF5372LCVM240?
    The maximum operating frequency is up to 200 MHz.
  3. Does the MCF5372LCVM240 support system debug?
    Yes, it supports system debug.
  4. Is JTAG support available for the MCF5372LCVM240?
    Yes, JTAG support is available for system level board testing.
  5. What is the temperature range for the MCF5372LCVM240?
    The temperature range is -40°C to 85°C.
  6. What type of package does the MCF5372LCVM240 come in?
    The package type is LQFP-240.
  7. What are the primary applications of the MCF5372LCVM240?
    The primary applications include industrial automation, control systems for machinery and equipment, and embedded systems requiring high performance and flexibility.
  8. Who is the manufacturer of the MCF5372LCVM240?
    The manufacturer is NXP Semiconductors.
  9. Where can I find detailed specifications for the MCF5372LCVM240?
    Detailed specifications can be found in the datasheet available on NXP Semiconductors' official website and other electronic component distributors like Mouser Electronics.
  10. Is the MCF5372LCVM240 suitable for high-performance industrial control systems?
    Yes, it is designed to provide high performance and flexibility for industrial control systems.

Product Attributes

Core Processor:Coldfire V3
Core Size:32-Bit Single-Core
Speed:240MHz
Connectivity:EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:DMA, POR, PWM, WDT
Number of I/O:62
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:32K x 8
Voltage - Supply (Vcc/Vdd):1.4V ~ 3.6V
Data Converters:- 
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:196-LBGA
Supplier Device Package:196-LBGA (15x15)
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Similar Products

Part Number MCF5372LCVM240 MCF5372LCVM240J MCF5373LCVM240 MCF53721CVM240
Manufacturer NXP USA Inc. Freescale Semiconductor NXP USA Inc. NXP USA Inc.
Product Status Not For New Designs Obsolete Not For New Designs Not For New Designs
Core Processor Coldfire V3 Coldfire V3 Coldfire V3 Coldfire V3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 240MHz 240MHz 240MHz 240MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 62 62 62 62
Program Memory Size - - - -
Program Memory Type ROMless ROMless ROMless ROMless
EEPROM Size - - - -
RAM Size 32K x 8 32K x 8 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V 1.4V ~ 3.6V 1.4V ~ 3.6V 1.4V ~ 3.6V
Data Converters - - - -
Oscillator Type External External External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 196-LBGA 196-LBGA 196-LBGA 196-LBGA
Supplier Device Package 196-LBGA (15x15) 196-LBGA (15x15) 196-LBGA (15x15) 196-LBGA (15x15)

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