MC9S12XDP512CAG
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NXP USA Inc. MC9S12XDP512CAG

Manufacturer No:
MC9S12XDP512CAG
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16BIT 512KB FLASH 144LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The MC9S12XDP512CAG is a high-performance microcontroller from NXP USA Inc., designed to meet the demands of various embedded applications. This microcontroller is based on the HCS12X core and is part of the MC9S12XD family, which offers enhanced processing capabilities. It is particularly targeted for automotive multiplexing and mid-range body applications, providing a robust solution with 32-bit performance in a 16-bit architecture.

Key Specifications

Specification Details
Core HCS12X
Bit Width 16-bit
Flash Memory 512 KB (512 K x 8)
EEPROM Up to 4 KB
Package Type 144-LQFP
VDDA Supply Voltage Range 3.15V - 3.6V
Analog-to-Digital Converter (ATD) 10-bit or 12-bit, depending on configuration
Clock and Reset Generator Pierce Oscillator, Clock Generation Module
Communication Interfaces SPI, SCI, CAN, etc.

Key Features

  • High-Performance Processing: Offers 32-bit performance in a 16-bit architecture, making it suitable for demanding applications.
  • Flash and EEPROM Memory: Features 512 KB of flash memory and up to 4 KB of EEPROM, providing ample storage for code and data.
  • Analog-to-Digital Conversion: Includes 10-bit or 12-bit ATD modules for precise analog-to-digital conversion.
  • Communication Interfaces: Supports various communication protocols such as SPI, SCI, and CAN, facilitating robust communication capabilities.
  • Clock and Reset Generator: Equipped with a Pierce Oscillator and a Clock Generation Module for reliable clocking and reset functions.

Applications

The MC9S12XDP512CAG microcontroller is primarily targeted for automotive applications, including multiplexing and mid-range body control. It is also suitable for other embedded systems that require high-performance processing, robust communication interfaces, and reliable analog-to-digital conversion. These applications can include industrial control systems, medical devices, and various IoT solutions.

Q & A

  1. What is the core architecture of the MC9S12XDP512CAG microcontroller?

    The MC9S12XDP512CAG is based on the HCS12X core.

  2. How much flash memory does the MC9S12XDP512CAG have?

    The MC9S12XDP512CAG has 512 KB of flash memory.

  3. What is the package type of the MC9S12XDP512CAG?

    The package type is 144-LQFP.

  4. What is the VDDA supply voltage range for the MC9S12XDP512CAG?

    The VDDA supply voltage range is 3.15V - 3.6V.

  5. Does the MC9S12XDP512CAG support analog-to-digital conversion?

    Yes, it includes 10-bit or 12-bit ATD modules.

  6. What communication interfaces are supported by the MC9S12XDP512CAG?

    The microcontroller supports SPI, SCI, CAN, and other communication protocols.

  7. What are the primary applications of the MC9S12XDP512CAG?

    The primary applications include automotive multiplexing and mid-range body control, as well as other embedded systems requiring high-performance processing.

  8. Does the MC9S12XDP512CAG have EEPROM memory?

    Yes, it has up to 4 KB of EEPROM memory.

  9. What clocking and reset functions are available on the MC9S12XDP512CAG?

    The microcontroller features a Pierce Oscillator and a Clock Generation Module.

  10. Where can I find detailed specifications for the MC9S12XDP512CAG?

    Detailed specifications can be found in the data sheet available on NXP's official website and other authorized distributors like Xecor and Utmel.

Product Attributes

Core Processor:HCS12X
Core Size:16-Bit
Speed:80MHz
Connectivity:CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:119
Program Memory Size:512KB (512K x 8)
Program Memory Type:Flash
EEPROM Size:4K x 8
RAM Size:32K x 8
Voltage - Supply (Vcc/Vdd):2.35V ~ 5.5V
Data Converters:A/D 24x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
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Similar Products

Part Number MC9S12XDP512CAG MC9S12XDP512CAL MC9S12XDP512MAG MC9S12XDT512CAG MC9S12XDP512VAG
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor
Product Status Active Active Active Active Active
Core Processor HCS12X HCS12X HCS12X HCS12X HCS12X
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 80MHz 80MHz 80MHz 80MHz 80MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 119 91 119 119 119
Program Memory Size 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 32K x 8 32K x 8 32K x 8 20K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V
Data Converters A/D 24x10b A/D 16x10b A/D 24x10b A/D 24x10b A/D 24x10b
Oscillator Type External External External External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 144-LQFP 112-LQFP 144-LQFP 144-LQFP 144-LQFP
Supplier Device Package 144-LQFP (20x20) 112-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)

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