LPC822M101JHI33K
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NXP USA Inc. LPC822M101JHI33K

Manufacturer No:
LPC822M101JHI33K
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Delivery:
Payment:
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Product Introduction

Overview

The LPC822M101JHI33K is a low-cost microcontroller (MCU) from NXP USA Inc., based on the Arm® Cortex®-M0+ core. This MCU is part of the LPC800 series, which offers a blend of value, integration, and performance, making it an ideal choice for entry-level and 8-bit alternative MCU applications. The LPC822M101JHI33K is supported by the MCUXpresso development environment, facilitating efficient design and development processes.

Key Specifications

Specification Details
Core Arm® Cortex®-M0+
Flash Memory 16 KB
SRAM 4 KB
Package HVQFN32 (5x5 mm)
Terminals 32
Operating Voltage 1.8 V to 3.6 V
Temperature Range -40°C to 85°C
Compliance PbFree, EU RoHS, Halogen Free, REACH SVHC compliant

Key Features

  • Low Power Consumption: Optimized for low power applications, making it suitable for battery-powered devices.
  • High Performance: Utilizes the Arm® Cortex®-M0+ core for efficient processing.
  • Peripheral Set: Includes a range of peripherals such as GPIO, UART, SPI, I2C, and ADC, enhancing its versatility.
  • Development Support: Supported by the MCUXpresso development environment, which includes tools for debugging, programming, and configuration.
  • Compact Package: Available in a small HVQFN32 package, ideal for space-constrained designs.

Applications

  • Consumer Electronics: Suitable for use in various consumer electronics such as remote controls, toys, and home appliances.
  • Industrial Automation: Can be used in industrial control systems, sensors, and automation devices.
  • IoT Devices: Ideal for Internet of Things (IoT) applications requiring low power and high performance.
  • Automotive Systems: Applicable in automotive systems for functions like dashboard controls and sensor interfaces.

Q & A

  1. What is the core architecture of the LPC822M101JHI33K MCU?

    The LPC822M101JHI33K MCU is based on the Arm® Cortex®-M0+ core.

  2. How much flash memory does the LPC822M101JHI33K have?

    The LPC822M101JHI33K has 16 KB of flash memory.

  3. What is the package type and size of the LPC822M101JHI33K?

    The LPC822M101JHI33K comes in a HVQFN32 package with a size of 5x5 mm.

  4. Is the LPC822M101JHI33K compliant with environmental regulations?

    Yes, it is PbFree, EU RoHS, Halogen Free, and REACH SVHC compliant.

  5. What is the operating voltage range of the LPC822M101JHI33K?

    The operating voltage range is from 1.8 V to 3.6 V.

  6. What development environment supports the LPC822M101JHI33K?

    The LPC822M101JHI33K is supported by the MCUXpresso development environment.

  7. What are some common applications of the LPC822M101JHI33K?

    Common applications include consumer electronics, industrial automation, IoT devices, and automotive systems.

  8. How much SRAM does the LPC822M101JHI33K have?

    The LPC822M101JHI33K has 4 KB of SRAM.

  9. What is the temperature range for the LPC822M101JHI33K?

    The temperature range is from -40°C to 85°C.

  10. Does the LPC822M101JHI33K support various communication protocols?

    Yes, it supports protocols such as UART, SPI, I2C, and more.

Product Attributes

Core Processor:ARM® Cortex®-M0+
Core Size:32-Bit Single-Core
Speed:30MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:29
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:4K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 12x12b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VFQFN Exposed Pad
Supplier Device Package:32-HVQFN (5x5)
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Similar Products

Part Number LPC822M101JHI33K LPC822M101JHI33Y LPC822M101JHI33E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Discontinued at Digi-Key
Core Processor ARM® Cortex®-M0+ - ARM® Cortex®-M0+
Core Size 32-Bit Single-Core - 32-Bit Single-Core
Speed 30MHz - 30MHz
Connectivity I²C, SPI, UART/USART - I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT - Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 29 - 29
Program Memory Size 16KB (16K x 8) - 16KB (16K x 8)
Program Memory Type Flash - Flash
EEPROM Size - - -
RAM Size 4K x 8 - 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V - 1.8V ~ 3.6V
Data Converters A/D 12x12b SAR - A/D 12x12b
Oscillator Type Internal - Internal
Operating Temperature -40°C ~ 105°C (TA) - -40°C ~ 105°C (TA)
Mounting Type Surface Mount - Surface Mount
Package / Case 32-VFQFN Exposed Pad - 32-VFQFN Exposed Pad
Supplier Device Package 32-HVQFN (5x5) - 32-HVQFN (5x5)

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