LPC4330FET100,551
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NXP USA Inc. LPC4330FET100,551

Manufacturer No:
LPC4330FET100,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT ROMLESS 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The NXP LPC4330FET100,551 is a high-performance, 32-bit microcontroller from the LPC4300 series, featuring a dual-core architecture with ARM Cortex-M4 and Cortex-M0 cores. This microcontroller is designed to provide a balance between high performance and low power consumption, making it suitable for a wide range of embedded applications. It is packaged in a 100-pin TFBGA (Thin Fine-Pitch Ball Grid Array) and is surface mountable.

Key Specifications

Parameter Value
Manufacturer NXP USA Inc.
Device Core ARM Cortex-M4/M0
Data Bus Width 32 bit
Operating Frequency Max 204 MHz
No. of Pins 100 Pins
No. of I/O's 49 I/O's
IC Case / Package TFBGA
Interfaces CAN, ENET, I2C, I2S, SPI, UART, USB
RAM Memory Size 264 KB
ADC Channels 16 Channels
ADC Resolution 10 Bit
Supply Voltage Min 2.2 V
Supply Voltage Max 3.6 V
Operating Temperature Min -40°C
Operating Temperature Max 85°C
IC Mounting Surface Mount

Key Features

  • Dual-core architecture with ARM Cortex-M4 and Cortex-M0 cores for high performance and low power consumption.
  • High-speed interfaces including CAN, Ethernet, I2C, I2S, SPI, UART, and USB.
  • 264 KB of SRAM and 16 channels of 10-bit ADC.
  • Support for two high-speed USBs with on-chip PHY.
  • AES engine and SPIFI (Serial Peripheral Interface Flash Interface) for secure data storage and transfer.
  • Configurable peripherals and a State Configurable Timer (SCT) for flexible system design.

Applications

  • Industrial automation and control systems.
  • Medical devices requiring high precision and reliability.
  • Automotive electronics, including infotainment and control systems.
  • Smart home and IoT applications where low power and high performance are crucial.
  • Robotics and drones, leveraging the microcontroller's advanced peripherals and processing capabilities.

Q & A

  1. What is the core architecture of the LPC4330FET100,551?

    The LPC4330FET100,551 features a dual-core architecture with ARM Cortex-M4 and Cortex-M0 cores.

  2. What is the maximum operating frequency of the LPC4330FET100,551?

    The maximum operating frequency is 204 MHz.

  3. How many I/O pins does the LPC4330FET100,551 have?

    The microcontroller has 49 I/O pins.

  4. What types of interfaces are supported by the LPC4330FET100,551?

    The microcontroller supports CAN, Ethernet, I2C, I2S, SPI, UART, and USB interfaces.

  5. What is the RAM memory size of the LPC4330FET100,551?

    The RAM memory size is 264 KB.

  6. What is the ADC resolution of the LPC4330FET100,551?

    The ADC resolution is 10 bits.

  7. What is the supply voltage range for the LPC4330FET100,551?

    The supply voltage range is from 2.2 V to 3.6 V.

  8. What is the operating temperature range for the LPC4330FET100,551?

    The operating temperature range is from -40°C to 85°C.

  9. Is the LPC4330FET100,551 RoHS compliant?
  10. What are some typical applications of the LPC4330FET100,551?

    Typical applications include industrial automation, medical devices, automotive electronics, smart home and IoT devices, and robotics.

Product Attributes

Core Processor:ARM® Cortex®-M4/M0
Core Size:32-Bit Dual-Core
Speed:204MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O:49
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:264K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 4x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC4330FET100,551 LPC4330FET180,551 LPC4310FET100,551 LPC4320FET100,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core
Speed 204MHz 204MHz 204MHz 204MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 49 118 49 49
Program Memory Size - - - -
Program Memory Type ROMless ROMless ROMless ROMless
EEPROM Size - - - -
RAM Size 264K x 8 264K x 8 168K x 8 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 180-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 180-TFBGA (12x12) 100-TFBGA (9x9) 100-TFBGA (9x9)

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