Overview
The MT53D512M32D2DS-053 WT ES:D TR is a DRAM chip produced by Micron Technology Inc. This component is specifically designed as a Mobile LPDDR4 SDRAM, offering a memory configuration of 512M x 32 bits. It is packaged in a 200-pin WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) and is tailored for automotive applications, operating within a temperature range of -25°C to 85°C. The chip was introduced on October 31, 2017, and is manufactured in China.
Key Specifications
| Description | Specification |
|---|---|
| DRAM Type | Mobile LPDDR4 SDRAM |
| Memory Configuration | 512M x 32 bits |
| Memory Size | 16 Gbit |
| Operating Voltage | 1.1V / 1.8V |
| Clock Frequency Max | 1.866 GHz |
| Package Type | 200-pin WFBGA |
| Temperature Range | -25°C to 85°C |
| Introduction Date | October 31, 2017 |
| Country of Origin | China |
Key Features
- High-speed data transfer with a maximum clock frequency of 1.866 GHz.
- Low power consumption, suitable for mobile and automotive applications.
- Compact 200-pin WFBGA package, ideal for space-constrained designs.
- Wide operating temperature range, making it suitable for harsh environments.
- Compliance with industry standards for LPDDR4 SDRAM.
Applications
The MT53D512M32D2DS-053 WT ES:D TR is designed for various applications, including:
- Automotive systems: Infotainment, navigation, and advanced driver-assistance systems (ADAS).
- Mobile devices: Smartphones, tablets, and other portable electronics.
- Industrial systems: High-performance computing, IoT devices, and other industrial applications requiring low power and high reliability.
Q & A
- What is the memory configuration of the MT53D512M32D2DS-053 WT ES:D TR? The memory configuration is 512M x 32 bits.
- What is the maximum clock frequency of this DRAM chip? The maximum clock frequency is 1.866 GHz.
- What is the operating voltage range of this component? The operating voltage range is 1.1V / 1.8V.
- What is the package type of this DRAM chip? The package type is 200-pin WFBGA.
- What is the temperature range for this component? The temperature range is -25°C to 85°C.
- When was this component introduced? It was introduced on October 31, 2017.
- Where is this component manufactured? It is manufactured in China.
- What are some common applications for this DRAM chip? Common applications include automotive systems, mobile devices, and industrial systems.
- What are the key features of this DRAM chip? Key features include high-speed data transfer, low power consumption, compact packaging, and a wide operating temperature range.
- Is this component suitable for harsh environments? Yes, it is suitable for harsh environments due to its wide operating temperature range.
