MT53D512M32D2DS-053 WT:D
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Micron Technology Inc. MT53D512M32D2DS-053 WT:D

Manufacturer No:
MT53D512M32D2DS-053 WT:D
Manufacturer:
Micron Technology Inc.
Package:
Tray
Description:
IC DRAM 16GBIT 1866MHZ 200WFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The MT53D512M32D2DS-053 WT:D, manufactured by Micron Technology Inc., is a high-density, low-power DDR4 SDRAM module designed for mobile and embedded applications. This memory chip offers a balance of high-speed operation and energy efficiency, making it suitable for a wide range of electronic devices. Introduced on October 31, 2017, this component is part of the LPDDR4 SDRAM family and is known for its compact form factor and wide temperature operating range.

Key Specifications

Specification Value
Memory Type DDR4 SDRAM
Capacity 16 Gb (512M x 32)
Data Rate Up to 3200 Mbps
Operating Voltage 1.2V
Operating Temperature Range -40°C to +95°C
Clock Frequency 1866 MHz
Package Type 200-pin WFBGA
RoHS Status Lead Free / RoHS Compliant

Key Features

  • High Density: Offers 16 Gb of storage capacity in a compact form factor.
  • Low Power Consumption: Operates at 1.2V, reducing energy usage in mobile and embedded devices.
  • High Data Rate: Supports data rates of up to 3200 Mbps for fast and responsive performance.
  • Wide Temperature Range: Suitable for operation in harsh environmental conditions.
  • On-Die Termination (ODT): Improves signal integrity and reduces system noise.

Applications

  • IoT Devices: Used to store sensor data, firmware, and configuration information.
  • Computers and Servers: Crucial components providing temporary storage for data and program code during active processing.
  • Automotive Electronics: Used for automotive applications to store firmware, manage engine control units (ECUs), store navigation data, and support various in-car entertainment systems.
  • Wearable Devices: Integrate into wearable devices such as smartwatches and fitness trackers to store user data, health indicators, and device settings.
  • Security Field: Used in security cameras, access control systems, and monitoring devices to store firmware, event logs, and captured video clips.

Q & A

  1. What is the main purpose of the MT53D512M32D2DS-053 WT:D?

    The MT53D512M32D2DS-053 WT:D is designed to provide high-density storage and high-speed data access while minimizing power consumption, making it suitable for mobile and embedded applications.

  2. What are the key specifications of the MT53D512M32D2DS-053 WT:D?

    The key specifications include a capacity of 16 Gb (512M x 32), a data rate of up to 3200 Mbps, an operating voltage of 1.2V, and an operating temperature range of -40°C to +95°C.

  3. What are the main features of the MT53D512M32D2DS-053 WT:D?

    The main features include high density, low power consumption, high data rate, wide temperature operating range, and on-die termination for improved signal integrity.

  4. In which applications is the MT53D512M32D2DS-053 WT:D commonly used?

    It is commonly used in IoT devices, computers and servers, automotive electronics, wearable devices, and security field applications.

  5. What is the package type of the MT53D512M32D2DS-053 WT:D?

    The package type is a 200-pin WFBGA (Wafer-Level Fine-Pitch Ball Grid Array).

  6. Is the MT53D512M32D2DS-053 WT:D RoHS compliant?

    Yes, the MT53D512M32D2DS-053 WT:D is Lead Free and RoHS compliant.

  7. What is the clock frequency of the MT53D512M32D2DS-053 WT:D?

    The clock frequency is 1866 MHz.

  8. Can the MT53D512M32D2DS-053 WT:D be used in place of other DDR4 SDRAM modules?

    While it can be used in similar applications, it is optimized for mobile and embedded systems with specific performance and energy efficiency requirements, so careful consideration is needed before substituting it with other modules.

  9. What are the advantages of using the MT53D512M32D2DS-053 WT:D?

    The advantages include high-density storage, low power consumption, high-speed data access, wide temperature operating range, and on-die termination for improved signal integrity.

  10. Are there any potential drawbacks to using the MT53D512M32D2DS-053 WT:D?

    Potential drawbacks include the need for careful PCB layout for optimal signal integrity and increased heat dissipation considerations due to its high density.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - Mobile LPDDR4
Memory Size:16Gb (512M x 32)
Memory Interface:- 
Clock Frequency:1.866 GHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:1.1V
Operating Temperature:-30°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:200-WFBGA
Supplier Device Package:200-WFBGA (10x14.5)
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